SV01A103AEA01B00 Murata, SV01A103AEA01B00 Datasheet - Page 16

Board Mount Motion & Position Sensors 10K OHM SMD

SV01A103AEA01B00

Manufacturer Part Number
SV01A103AEA01B00
Description
Board Mount Motion & Position Sensors 10K OHM SMD
Manufacturer
Murata

Specifications of SV01A103AEA01B00

Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SV01A103AEA01B00
Manufacturer:
MURATA
Quantity:
250
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
<2> When mounting the product by hand and soldering it with
<3> Washing
14
Continued from the preceding page.
(3) Reflow temperature profile
a soldering iron
(1) Quantity of solder
(2) Soldering iron
• This product is not of a sealed construction so you cannot wash it.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
The standard conditions are shown to the right.
• For both SMD and leaded products, supply a quantity
• The standard wire solder is Sn-3Ag-0.5Cu.
• The standard conditions are as shown at right.
• When soldering, take care that the tip of the soldering
• Heat both the terminal and the land at the same time
SV01 Series Application Manual
of wire solder that is within the range where solder
bridging between the terminals does not occur.
iron does not come into direct contact with the
product (cover, rotor, plastic substrate, etc.).
If such contact does occur, the product may be
damaged.
so that the wire solder melts quickly. This will reduce
deformation of the resin substrate of the product due
to heat transmitted from the terminals.
Temperature of soldering iron tip
Soldering time
Diameter of the soldering iron tip
Wattage of iron
#2 terminal
Resin Substrate
300
250
200
150
100
50
0
Resistive Element
Peak temperature: 245 3 C
Number of reflow solderings: 2 passes max
Pre-heating (in air)
60 to 120 sec.
150 to 180 C
Rotor
: 350 10 C
: Within 3 seconds per terminal
: ø3mm max.
: 30W max.
Slider
Continued on the following page.
(Solder melting zone)
30 to 60 sec.
Soldering Gradual cooling
220 C
#1 terminal
Cover
#2 terminal
(in air)
#3 terminal
R51E.pdf
09.3.26

Related parts for SV01A103AEA01B00