CG0603MLE-18E Bourns Inc., CG0603MLE-18E Datasheet - Page 2

• Manufacturer Part Number: CG0603MLE-18E
• Description: CHIP GUARD
• Manufacturer: Bourns Inc.

Specifications of CG0603MLE-18E

• Number Of Circuits: 1
• Maximum Ac Volts: 8.5VAC
• Maximum Dc Volts: 18VDC
• Package / Case: 0603 (1608 Metric)
• Suppressor Type: ESD Clamp Protector
• Peak Surge Current @ 8/20µs: 20A
• Varistor Case: 0603
• Clamping Voltage Vc Max: 60V
• Voltage Rating Vdc: 12V
• Voltage Rating Vac: 8.5Vrms
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Varistor Voltage: -
• Current-surge: -
• Energy: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ChipGuard
Package Option
Multilayer Series Designator
Operating Voltage
Tape & Reel Packaging
Ni barrier terminations are standard on all ChipGuard
• This product can be damaged by rapid heating, cooling or localized heating.
• Heat shocks should be avoided. Preheating and gradual cooling recommended.
• Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
• Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
How to Order
Product Dimensions
Solder Refl ow Recommendations
A solder gun under 30 watts is recommended.
18 = 18 V
E = 4,000 pcs. per reel (0603 package)
0402 = 0402 Package
3312 - 2 mm SMD Trimming Potentiometer
ChipGuard
Dimension
300
250
200
150
100
50
0
®
W
Product Designator
B
L
A
Preheat Stages 1-3
L
110 sec. (min.)
®
MLE Series Varistor ESD Clamp Protectors
0603 = 0603 Package
W
Time (seconds)
Soldering
30-70
sec.
(0.04 ± 0.006)
(0.02 ± 0.004)
(0.02 ± 0.004)
(0.10 ± 0.006)
CG0402MLE
1.00 ± 0.15
0.50 ± 0.10
0.50 ± 0.10
0.25 ± 0.15
Series
G = 10,000 pcs. per reel (0402 package)
120 sec. (min.)
®
Cooling
part numbers.
B
A
(0.064 ± 0.008)
(0.032 ± 0.008)
(0.032 ± 0.008)
(0.012 ± 0.008)
CG0603MLE
CG 0402 MLE - 18 G
1.60 ± 0.20
0.80 ± 0.20
0.80 ± 0.20
0.30 ± 0.20
DIMENSIONS:
Series
A
B
C
D
E
Customers should verify actual device performance in their specifi c applications.
Stage 1 Preheat
Stage 2 Preheat
Stage 3 Preheat
Main Heating
Cooling
(INCHES)
MM
Ambient to Preheating
Temperature
140 °C to 160 °C
Preheat to 200 °C
200 °C
210 °C
220 °C
230 °C
240 °C
200 °C to 100 °C
Recommended Pad Layout
Dim.
Specifi cations are subject to change without notice.
B
C
D
A
CG0402MLE
C
Series
(0.020)
(0.024)
(0.020)
(0.067)
0.51
0.61
0.51
1.70
D
30 s to 60 s
60 s to 120 s
20 s to 40 s
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
1 °C/s to 4 °C/s
CG0603MLE
(0.030)
(0.040)
(0.020)
(0.100)
Series
0.76
1.02
0.50
2.54
A
B