TLF9UA502WR32K1 Taiyo Yuden, TLF9UA502WR32K1 Datasheet - Page 29

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TLF9UA502WR32K1

Manufacturer Part Number
TLF9UA502WR32K1
Description
CHOKE COMMON MODE 5000UH
Manufacturer
Taiyo Yuden
Series
TLF9UAr
Datasheet

Specifications of TLF9UA502WR32K1

Current
320mA
Inductance
5mH
Dc Resistance (dcr)
2.5 Ohm Max
Filter Type
Common Mode - 2 Line Array
Package / Case
0.669" L x 0.433" W x 0.630" H (17.00mm x 11.00mm x 16.00mm)
Mounting Type
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Impedance
-
Other names
587-2791

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TLF9UA502WR32K1
Manufacturer:
TAIYO/太诱
Quantity:
20 000
co0102tr01_reli-RP4
CM04RC, BU05MC, CM01
* This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
Precautions
Precautions
Precautions
Precautions
Precautions
Precautions
Precautions
1. Circuit Design
2. PCB Design
3. Considerations for automatic placement
4. Soldering
5. Cleaning
6. Handling
7. Storage conditions
Technical
consider-
Technical
consider-
Technical
consider-
Technical
consider-
Technical
consider-
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
PRECAUTIONS
ations
ations
ations
ations
ations
◆Operating environment
◆Land pattern design
◆Land pattern design
◆Adjustment of mounting machine
◆Adjustment of mounting machine
◆Reflow soldering
◆Lead free soldering
◆Recommended conditions for using a soldering iron
◆Reflow soldering
◆Cleaning conditions
◆Handling
◆Breakaway PC boards (splitting along perforations)
◆Mechanical considerations
◆Pick-up pressure
◆Packing
◆Handling
◆Breakaway PC boards (splitting along perforations)
◆Mechanical considerations
◆Pick-up pressure
◆Packing
◆Storage
◆Storage
【CM04RC, BU05MC】
【CM01】
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to these products is reflow soldering only.
・ Recommended Land Patterns
1.8
Surface Mounting
1. The products described in this specification are intended for use in general electronic equipment, (office supply equipment, telecommunications systems,
1. Please contact any of our offices for a land pattern, and refer to a recommended land pattern of specifications.
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. This product can be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering heat, soldering etc sufficiently.
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products.
1. Please contact any of our offices for a cleaning.
1. Keep the product away from all magnets and magnetic objects.
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push onto an exposed part of ferrite cores.
1. Please avoid accumulation of a packing box as much as possible.
1. There is a case that a characteristic varies with magnetic influence.
1. The position of the product on PCBs shall be carefully considereed to minimize the stress caused from splitting of the PCBs.
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
1. An excessive shock or stress may cause a damage to the product or a detrioration of a characteristic.
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled.
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration
・ Put the soldering iron on the land-pattern.
・ Soldering iron's temperature - Below 350℃
・ Duration - 3 seconds or less
・ The soldering iron should not directly touch the inductor.
・ Please do not conduct an adjustment with a soldering iron because the wire would be broken due to its thinness.
・ Recommended conditions
measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high
reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where
product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
oftaping/packaging materials may take place.
【CM04RC】
The ambient temperature must be kept below 30℃. Even under ideal storage conditions, the solderability of electrodes may decrease gradually. For this reason,
the products should be used within one year from the time of delivery. In case of storage over 6 months, solderability shall be checked before actual usage.
0.74
(2 Lines)
Ambient temperature : 0~40℃, Humidity : Below 70% RH
1.8
1.6
6.7
1.6
1.8
0.74
(3 Lines)
1.8
0.74
1.8
1.6
6.7
1.6
1.8
0.74
(4 Lines)
1.8
0.74
1.8
0.74
1.8
1 1
1.6
6.7
1.6
1
0.5
【BU05MC】
1
0.5
1
1.4
3.2
1.4
0.4
0.3
1.1
【CM01】
co0102tr01_reli_e-01
0.4
0.45
0.65 1.55
0.45
Unit : mm

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