GRM43DR61E106KA12L Murata, GRM43DR61E106KA12L Datasheet - Page 147

Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 1812 10uF 25volts X5R 10%

GRM43DR61E106KA12L

Manufacturer Part Number
GRM43DR61E106KA12L
Description
Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 1812 10uF 25volts X5R 10%
Manufacturer
Murata
Series
GRMr

Specifications of GRM43DR61E106KA12L

Voltage Rating
25 Volts
Operating Temperature Range
- 55 C to + 85 C
Temperature Coefficient / Code
X5R
Product
General Type MLCCs
Dimensions
3.2 mm W x 4.5 mm L x 2 mm H
Termination Style
SMD/SMT
Capacitance
10 uF
Tolerance
10 %
Package / Case
1812 (4532 metric)
Dielectric Characteristic
X5R
Capacitance Tolerance
± 10%
Capacitor Case Style
1812
Capacitor Mounting
SMD
Svhc
No
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. PCB Design
1. Notice for Pattern Forms
Pattern Forms
and Leaded Components
Placing Close to Chassis
of Leaded Components
Notice
after Chip Component
of Chip Components
1-1. Unlike leaded components, chip components are
1-2. It is possible for the chip to crack by the expansion
Soldering and Mounting
Lateral Mounting
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
susceptible to flexing stresses since they are
mounted directly on the substrate.
They are also more sensitive to mechanical and
thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses
and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration
to eliminate the possibility of excess solder fillet
height.
and shrinkage of a metal board. Please contact us if
you want to use our ceramic capacitors on a metal
board such as Aluminum.
Placing
Placing
Electrode Pattern
Lead Wire
Solder (ground)
Prohibited
Chassis
Soldering Iron
Lead Wire
Solder Resist
Solder Resist
Solder Resist
Correct
Solder Resist
Continued on the following page.
Notice
145
C02E.pdf
10.12.20

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