DSPIC30F1010T-30I/SO Microchip Technology, DSPIC30F1010T-30I/SO Datasheet - Page 259

• Manufacturer Part Number: DSPIC30F1010T-30I/SO
• Description: 6KB, Flash, 256bytes-RAM, 30MIPS, 21I/O, 16-bit Family,nanoWatt 28 SOIC .300in T
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F1010T-30I/SO

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 6KB (2K x 24)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Data Bus Width: 16 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240002, DM300023, DM330011
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 6 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300023 - KIT DEMO DSPICDEM SMPS BUCK
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: DSPIC30F1010T-30I/SOTR

FIGURE 21-15:
© 2006 Microchip Technology Inc.
Note: Refer to Figure 21-1 for load conditions.
(CKP = 0)
(CKP = 1)
SDI
SDI
SCK
SDO
SS
SCK
X
X
X
X
X
SP60
SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS
SP50
SP40
MSb IN
SP71
SP41
MSb
SP30,SP31
SP70
SP52
BIT14 - - - - - -1
BIT14 - - - -1
Preliminary
SP35
dsPIC30F1010/202X
SP73
SP72
LSb
LSb IN
SP72
SP73
SP52
SP51
DS70178C-page 257