MCP9805T-BE/ST Microchip Technology, MCP9805T-BE/ST Datasheet - Page 2

• Manufacturer Part Number: MCP9805T-BE/ST
• Description: IC,TEMPERATURE SENSOR,TSSOP,8PIN,PLASTIC
• Manufacturer: Microchip Technology

Specifications of MCP9805T-BE/ST

• Rohs Compliant: YES
• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Register Bank
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 125°C
• Output Type: I²C™/SMBus™
• Output Alarm: No
• Output Fan: Yes
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP
• Temperature Threshold: Programmable
• Full Temp Accuracy: 3 C
• Digital Output - Bus Interface: I2C, SMBus
• Digital Output - Number Of Bits: 10 bit
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 20 C
• Supply Current: 500 uA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

MCP9805
1.0
Absolute Maximum Ratings †
V
Voltage at all Input/Output pins .... GND – 0.3V to 5.5V
Storage temperature ..........................-65°C to +150°C
Ambient temp. with power applied .....-40°C to +125°C
Junction Temperature (T
ESD protection on all pins (HBM:MM)....... (4 kV:200V)
Latch-Up Current at each pin ........................ ±200 mA
DS21977B-page 2
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, V
Power Supply
Operating Voltage Range
Operating Current
Shutdown Current
Power-On Reset Threshold (POR)
Power Supply Rejection
Temperature Sensor Accuracy
Accuracy with 0.25 °C/LSb Resolution:
Internal
Conversion Time (10-bits + Sign):
Event Output (Open-Drain)
High-Level Current (leakage)
Low-Level Voltage
Thermal Response
Response Time (Note):
DD
Note:
+75°C to +95°C
+40°C to +125°C
-20°C to +125°C
T
DFN
TSSOP
0.25 °C/LSb
....................................................................... 6.0V
A
= -40°C
ELECTRICAL
CHARACTERISTICS
Thermal response with 1x1 inch dual-sided copper clad.
ADC
Parameters
J
)................................ +150°C
PSR
PSR
t
I
V
T
T
T
T
Sym
SHDN
CONV
t
t
V
V
I
I
RES
RES
POR
ACY
ACY
ACY
ACY
DD
OH
DD
OL
DC
AC
Min
-1.0
-2.0
-3.0
3.0
—
—
—
—
—
—
—
—
—
—
—
DD
= 3.0V to 3.6V, GND = Ground and T
±0.3
±0.5
±0.5
±1.0
±2.0
Typ
200
†Notice: Stresses above those listed under “Maximum
ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
0.1
2.2
0.7
1.5
±2
65
—
—
—
Max
+1.0
+2.0
+3.0
500
125
3.6
0.4
—
—
—
—
—
—
2
1
Unit
ms
µA
µA
µA
°C
°C
°C
°C
°C
°C
V
V
V
s
s
© 2005 Microchip Technology Inc.
Continuous Operation
Shutdown Mode
V
V
(0 to 1 MHz), T
Active Temp. Range
Monitor Temp. Range
17 samples/sec. (typ.)
V
I
Time to 63% of +22°C (Air)
to +125°C (Oil Bath)
OL
DD
DD
OH
= 3 mA
Falling Edge
= 3.3V + 150 mVpp
= 3.6V
A
Conditions
= -20°C to +125°C.
A
= +25°C