APDS-9004-020 Avago Technologies US Inc., APDS-9004-020 Datasheet - Page 9

• Manufacturer Part Number: APDS-9004-020
• Description: AMBIENT LIGHT SENSOR 4CHIPLED
• Manufacturer: Avago Technologies US Inc.
• Type: Ambient Light Photo Sensorr

Specifications of APDS-9004-020

• Peak Wavelength: 620 nm
• Maximum Light Current: 370 uA
• Maximum Dark Current: 0.5 uA
• Maximum Rise Time: 0.95 ms
• Maximum Fall Time: 0.8 ms
• Package / Case: 1206
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Product: Ambient Light Sensor
• Package: 4Chip LED
• Rise Time: 950 ns
• Fall Time: 800 ns
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1716-2; APDS-9004-021

Recommended Reflow Profile
The reflow profile is a straight-line representation of a
nominal temperature profile for a convective reflow
solder process. The temperature profile is divided into
four process zones, each with different ∆T/∆time
temperature change rates or duration. The ∆T/∆time
rates or duration are detailed in the above table. The
temperatures are measured at the component to
printed circuit board connections.
In process zone P1, the PC board and APDS-9004 pins
are heated to a temperature of 150°C to activate the
flux in the solder paste. The temperature ramp up rate,
R1, is limited to 3°C per second to allow for even
heating of both the PC board and APDS-9004 pins.
Process zone P2 should be of sufficient time duration
(100 to 180 seconds) to dry the solder paste. The
temperature is raised to a level just below the liquidus
point of the solder, usually 200°C (392°F).
Process zone P3 is the solder reflow zone. In zone P3,
the temperature is quickly raised above the liquidus
point of solder to 255°C (491°F) for optimum results.
9
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
Peak Temperature
Time maintained above 217°C
Time within 5°C of actual Peak Temperature
Time 25°C to Peak Temperature
150
120
255
230
217
200
180
25
80
0
HEAT
R1
P1
UP
50
R2
SOLDER PASTE DRY
P2
100
Symbol
P2, R2
P3, R3
P3, R4
P4, R5
P1, R1
150
200°C to 255°C
255°C to 200°C
150°C to 200°C
25°C to 150°C
200°C to 25°C
25°C to 260°C
The dwell time above the liquidus point of solder
should be between 20 and 40 seconds. It usually takes
about 20 seconds to assure proper coalescing of the
solder balls into liquid solder and the formation of good
solder connections. Beyond a dwell time of 40 seconds,
the intermetallic growth within the solder connections
becomes excessive, resulting in the formation of weak
and unreliable connections. The temperature is then
rapidly reduced to a point below the solidus
temperature of the solder, usually 200°C (392°F), to
allow the solder within the connections to freeze solid.
Process zone P4 is the cool down after solder freeze.
The cool down rate, R5, from the liquidus point of the
solder to 25°C (77°F) should not exceed 6°C per second
maximum. This limitation is necessary to allow the PC
board and APDS-9004 pins to change dimensions
evenly, putting minimal stresses on the APDS-9004.
It is recommended to perform reflow soldering no
more than twice.
R3
60 sec to 90 sec
> 217°C
> 255°C
Above 217 C
MAX 260 C
260°C
REFLOW
SOLDER
T
P3
200
R4
COOL DOWN
Maximum T/ time or Duration
P4
R5
250
100s to 180s
60s to 90s
20s to 40s
t-TIME
(SECONDS)
-6°C/s
-6°C/s
8mins
3°C/s
3°C/s
300