FUSE, THERMAL, 167°C, 10A, 250V

G4A01167C

Manufacturer Part NumberG4A01167C
DescriptionFUSE, THERMAL, 167°C, 10A, 250V
ManufacturerTHERMODISC
SeriesMICROTEMP
G4A01167C datasheet
 

Specifications of G4A01167C

Voltage Rating Vac250VFuse Current10A
Fuse TerminalsFerruleFunctioning Temperature167°C
Holding Temperature142°CLead Free Status / RoHS StatusLead free / RoHS Compliant
1
Page 1
2
Page 2
3
Page 3
4
Page 4
5
Page 5
6
Page 6
7
Page 7
8
Page 8
9
Page 9
10
Page 10
11
12
13
14
15
16
17
18
Page 5/18

Download datasheet (285Kb)Embed
PrevNext
Packaged Thermal Cutoffs
Therm-O-Disc also offers a variety of packaging options for MICROTEMP
Therm-O-Disc offers two standard packages with wide application in the HVAC industry. Primarily
designed for heating applications, the GXAM04 and GXAM06 packages mount a standard G4 or
G5 TCO in a high temperature ceramic base (see figure 5).
The popular GXAP Potted TCO packages consist of a TCO epoxy-potted into a plastic insulating
mounting case. The assembly can be supplied with various case materials, shapes and terminations.
They can be used to accurately sense temperature as probes and as surface, airstream and ambient
sensors (see figure 6). They can be easily replaced in the field without disturbing the rest of the circuit.
Custom packages, insulations or special assemblies may be specified to meet specific unique
application needs. By taking advantage of our technical expertise and high volume production
methods and equipment, we can provide significant savings on custom packages.
Packaged TCO Material Specifications
Type
Base Material
GXAP01
Valox DR48
GXAP02
Ryton R-4
GXAP04
Valox DR48
GXAP05
Valox DR48
GXAP08
Ryton R-7
GXAP10
Ryton R-7
GXAP12
Valox DR48
GXAM04
Ceramic DIN VDE 0335, C 221
GXAM06
Ceramic DIN VDE 0335, C 221
GXAM06
GXAM04
Figure 5
®
thermal cutoffs.
Material Rating
Maximum TCO
Temperature °C
Temperature °C
120
128
220
152
120
128
120
128
220
184
220
184
120
128
>250
240
>250
240
GXAP04
GXAP12
GXAP08
GXAP05
Figure 6
GXAP02
139