IRF7555PBF International Rectifier, IRF7555PBF Datasheet

MOSFET, DUAL, PP, MICRO-8

IRF7555PBF

Manufacturer Part Number
IRF7555PBF
Description
MOSFET, DUAL, PP, MICRO-8
Manufacturer
International Rectifier
Datasheet

Specifications of IRF7555PBF

Module Configuration
Dual
Transistor Polarity
P Channel
Continuous Drain Current Id
4.3A
Drain Source Voltage Vds
20V
On Resistance Rds(on)
55mohm
Rds(on) Test Voltage Vgs
-4.5V
Threshold Voltage Vgs
RoHS Compliant
Description
Absolute Maximum Ratings
Thermal Resistance
New trench HEXFET power MOSFETs from International
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design that HEXFET
Power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a wide
variety of applications.
The new Micro8 package has half the footprint area of the
standard SO-8. This makes the Micro8 an ideal package for
applications where printed circuit board space is at a premium.
The low profile (<1.1mm) of the Micro8 will allow it to fit easily
into extremely thin application environments such as portable
electronics and PCMCIA cards.
www.irf.com
V
I
I
I
P
P
V
E
dv/dt
T
R
D
D
DM
Ultra Low On-Resistance
Dual P-Channel MOSFET
Very Small SOIC Package
Available in Tape & Reel
Trench Technology
Low Profile (<1.1mm)
J
DS
D
D
GS
AS
@ T
@ T
JA
, T
@T
@T
STG
A
A
A
A
= 25°C
= 70°C
= 25°C
= 70°C
Drain-Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Maximum Power Dissipation
Maximum Power Dissipation
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
Parameter
Maximum Junction-to-Ambient
Linear Derating Factor
Soldering Temperature, for 10 seconds
Single Pulse Avalanche Energy„
Gate-to-Source Voltage
Parameter

GS
GS
@ -4.5V
@ -4.5V
Max.
G 2
G 1
S2
S 1
1
2
3
4
T o p V ie w
HEXFET
240 (1.6mm from case)
8
7
6
5
-55 to + 150
D 1
D 1
D 2
D 2
100
Max.
Micro8
1.25
-4.3
-3.4
Units
-20
-34
0.8
1.1
36
10
± 12
®
R
IRF7555
Power MOSFET
DS(on)
V
DSS
= 0.055
PD -91865B
= -20V
mW/°C
Units
V/ns
°C/W
°C
mJ
W
W
V
A
2/2/00
V
1

Related parts for IRF7555PBF

IRF7555PBF Summary of contents

Page 1

Trench Technology Ultra Low On-Resistance Dual P-Channel MOSFET Very Small SOIC Package Low Profile (<1.1mm) Available in Tape & Reel Description New trench HEXFET power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon ...

Page 2

IRF7555 Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source ...

Page 3

VGS TOP -7.50V -5.00V -4.00V -3.50V -3.00V -2.50V -2.00V BOTTOM -1.50V 10 1 -1.50V 20µs PULSE WIDTH 0.1 0 Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 100 ° T ...

Page 4

IRF7555 1600 1MHz iss rss oss ds gd 1200 C iss 800 400 C oss C rss ...

Page 5

T , Case Temperature ( C) C Fig 9. Maximum Drain Current Vs. Case Temperature 1000 100 D = 0.50 0.20 0.10 10 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) ...

Page 6

IRF7555 Package Outline Micro8 Outline Dimensions are shown in millimeters (inches (. ...

Page 7

Tape & Reel Information Micro8 Dimensions are shown in millimeters (inches -48 1 & E ...

Related keywords