ICK PGA 8 X 8 X 12 FISCHER ELEKTRONIK, ICK PGA 8 X 8 X 12 Datasheet

ICK PGA 8 X 8 X 12

Manufacturer Part Number

ICK PGA 8 X 8 X 12

Description

HEAT SINK

Manufacturer

FISCHER ELEKTRONIK

Datasheet

1.ICK_PGA_8_X_8_X_12.pdf (1 pages)

Specifications of ICK PGA 8 X 8 X 12

Packages Cooled

PGA

Thermal Resistance

14.8K/W

Width

23mm

Height

12.3mm

Length

23mm

Mounting Type

Thermally Conductive Adhesive / Foil

Body Plating

Black Anodized

For Use With

IC Design PGAs

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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Heatsinks for PGA /

23 x 23 x 12,3 mm, for IC design PGA and others

Parameters of article ICK PGA 8 x 8 x 12

Accessories/ related articles

Thermally conductive foil both sides adhesive / WLFT 404 23 x 23

Thermally conductive foil both sides adhesive / WLFT 405 23 x 23

dissipation loss [W]

mounting method

socket

suitable for processor type universal

width [mm]

heigth [mm]

plate thickness [mm]

length on stock [mm]

surface treatment

[K/W]

ICK PGA 8 x 8 x 12

14.8

8.1

therm. conductive foil / therm. cond. adhesive

universal

12.3

2.5

black anodised

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