1921125-5 Tyco Electronics, 1921125-5 Datasheet - Page 2

• Manufacturer Part Number: 1921125-5
• Description: IC SOCKET BGA 0.5MM 25X25
• Manufacturer: Tyco Electronics
• Type: BGAr

Specifications of 1921125-5

• Number Of Positions Or Pins (grid): 625 (25 x 25)
• Pitch: 0.020" (0.50mm)
• Mounting Type: Through Hole
• Features: Closed Frame
• Contact Finish: Silver
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Contact Finish Thickness: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: A97437

LGA Package
PRODUCT CHARACTERISTICS
The innovative polymer material system provides a highly conductive interconnect. This
proprietary material consists of a high temperature polymer compound that has been
embedded with metallized particles. The material is formed into contacts. The contacts are
held in place by a thin polyimide substrate. When mechanically compressed, the contacts’
electrical characteristics are optimized.
The unique design of the BGA socket uses an anti-overstress feature which protects the
contact and also provides a “well” for the ball to rest in. This “well” acts as an alignment
feature which centers the BGA ball to the MPI column. Corner frames provide for gross
alignment of the package to the socket.
The Matrix series sockets are available as fully arrayed sockets up to 40 x 40 contacts,
1600 I/O. Consult Tyco Electronics for custom socket and hardware solutions.
PRODUCT CHARACTERISTICS
Polyimide
Substrate
Anti-overstress
PC Board
Polyimide
Substrate
Stop
LGA Contact Compressed
Contact to Solder Ball Interface
Well
LOAD
LOAD
Contact
Bolster Plate
LGA Pad
BGA Package
Contact
BGA Ball
0.5mm LGA/BGA Sockets
0.5mm LGA/BGA Sockets
Close up of BGA corner
frame and contacts
Close up of LGA corner
frame and contacts
Page 2