CHP1206L13M7GNT Vishay, CHP1206L13M7GNT Datasheet - Page 3

• Manufacturer Part Number: CHP1206L13M7GNT
• Description: RESISTOR, THICK FILM, 13.7MOHM, 250mW, 2%
• Manufacturer: Vishay
• Series: CHPr

Specifications of CHP1206L13M7GNT

• Resistance: 13.7Mohm
• Resistance Tolerance: ± 2%
• Power Rating: 250mW
• Voltage Rating: 150V
• Resistor Element Material: Thick Film
• Temperature Coefficient: ± 200ppm/°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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56
CHP, HCHP
Vishay Sfernice
ELECTRICAL SPECIFICATIONS
Resistance range:
Resistance tolerance:
Power dissipation:
Temperature coefficient: K: 100 ppm/°C
MECHANICAL SPECIFICATIONS
Substrate:
Technology:
Protection:
Terminations:
Note
• Refer to Application Note “Guidelines for Vishay Sfernice
CLIMATIC SPECIFICATIONS
Operating temp. range:
Note
•
BEST TOL. AND TCR VERSUS OHMIC VALUE
Note
(1)
CHIPS FOR HIGH FREQUENCY APPLICATIONS
The HF performance of flip chip and W/A types can be
improved on request.
Please ask for HCHP
POWER DERATING CURVE
Resistive and Inductive Components” (document number: 52029)
for recommended reflow profile. Profile #3 applies.
For temperature up to 215 °C please consult Vishay Sfernice
TOLERANCE
Improved performance on request
TIGHTEST
0.5 % (D)
2 % (G)
1 % (F)
5 % (J)
100
80
60
40
20
0
0
20
0.1 Ω < R < R max.
1 Ω < R < R max.
40
10 Ω < R < 5M
5 Ω < R < 10M
VALUES
OHMIC
60
Alumina
Thick film (Ruthenium oxyde)
Epoxy coating
B (W/A): SnPb over nickel
barrier for solder reflow
N (W/A): SnAg over nickel
barrier for solder reflow
F (Flip Chip): SnAg over nickel
barrier for solder reflow
W (one face) and G (W/A) type:
gold over nickel barrier for other
applications
0.1R to 100M
0.5 % to 10 %
Pn: 50 mW to 2 W
L: 200 ppm/°C
- 55 °C to + 155 °C
70
Ambient Temperature in °C
80
100
(< 0.25 % at Pn at 70 °C during 1000 h)
For technical questions, contact:
120
BEST TCR
High Stability Resistor Chips
ppm/°C
100 (K)
100 (K)
200 (L)
200 (L)
140 155
Thick Film Technology
(1)
PACKAGING
ESD packaging available: Waffle pack and plastic tape and
reel (low conductivity). Paper tapes available on request
(ESD only).
Note
(2)
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the top
of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay Sfernice for specific ordering
code
Tape and Reel
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered is between the MOQ and the
maximum reel capacity, only one reel is provided.
When several reels are needed for ordered quantity
within MOQ and maximum reel capacity: Please consult
Vishay Sfernice for specific ordering code
SIZE
0502
0505
0603
0805
1005
1206
1505
2010
1010
2208
1020
2512
12 mm on request
[e-mail]
NUMBER OF PIECES PER PACKAGE
WAFFLE
PACK
100
140
100
60
60
60
45
MIN.
TAPE AND REEL
100
Document Number: 52023
MAX.
4000
1000
4000
1000
2000
Revision: 15-Sep-10
8 mm
8 mm
8 mm
8 mm
8 mm
WIDTH
TAPE
8 mm
(2)
(2)
(2)
(2)
(2)