HSDL-3020-021 Avago Technologies US Inc., HSDL-3020-021 Datasheet - Page 14

• Manufacturer Part Number: HSDL-3020-021
• Description: Infrared Transceivers Orion 2 FIR + RC
• Manufacturer: Avago Technologies US Inc.

Specifications of HSDL-3020-021

• Wavelength: 875 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 4 mW/sr
• Half Intensity Angle Degrees: 30 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 40 ns, 600 ns
• Maximum Fall Time: 40 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Maximum Forward Current: 190 mA
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 10.4 mm x 2.95 mm x 2.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Metal solder Stencil
Aperture
It is recommended that only a
0.152 mm (0.006 inch) or a
0.127 mm (0.005 inch) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. See Table
1, below the drawing, for combin-
ations of metal stencil aperture
and metal stencil thickness that
should be used. Aperture opening
for shield pad is 3.05 mm x 1.1
mm as per land pattern.
Adjacent Land Keepout and Solder
Mask Areas
Adjacent land keepout is the
maximum space occupied by the
unit relative to the land pattern.
There should be no other SMD
14
h
SOLDER MASK
j
Figure 3. Solder stencil aperture.
Table 1.
Stencil Thickness, t (mm)
0.127 mm
0.11 mm
components within this area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm. It is recommended that
two fiducial crosses be placed at
l
APERTURES AS PER
LAND DIMENSIONS
k
l
Aperture Size (mm)
Length, l
1.75 0.05
2.4 0.05
DIMENSION
h
l
k
j
mid length of the pads for unit
alignment.
Note: Wet/Liquid Photo-imageable
solder resist/mask is recommended.
mm
0.2
3.0
3.85
11.9
w
Width, w
0.55 0.05
0.55 0.05
t