HSDL-3020-021 Avago Technologies US Inc., HSDL-3020-021 Datasheet - Page 15

• Manufacturer Part Number: HSDL-3020-021
• Description: Infrared Transceivers Orion 2 FIR + RC
• Manufacturer: Avago Technologies US Inc.

Specifications of HSDL-3020-021

• Wavelength: 875 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 4 mW/sr
• Half Intensity Angle Degrees: 30 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 40 ns, 600 ns
• Maximum Fall Time: 40 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Maximum Forward Current: 190 mA
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 10.4 mm x 2.95 mm x 2.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix B: PCB Layout Suggestion
The effects of EMI and power
supply noise can potentially
reduce the sensitivity of the
receiver, resulting in reduced link
distance. The PCB layout played
an important role to obtain a good
PSRR and EM immunity resulting
in good electrical performance.
Things to note:
1. The ground plane should be
2. The shield trace is a wide, low
3. IR and RC VLED can be
15
continuous under the part, but
should not extend under the
shield trace.
inductance trace back to the
system ground. CX1, CX2,
CX3, CX4, CX5, CX6 and CX7
are optional supply filter
capacitors; they may be left
out if a clean power supply is
used.
connected to either unfiltered
or unregulated power supply.
The bypass capacitors should
be connection before the
current limiting resistor R3
4. V
5. IOV
6. Preferably a multi-layered
and R4 respectively. In a noisy
environment, including
capacitor CX2 and CX7 can
enhance supply rejection. CX6
and CX3 that are generally a
ceramic capacitor of low
inductance providing a wide
frequency response while CX2
and CX4 are tantalum
capacitor of big volume and
fast frequency response. The
use of a tantalum capacitor is
more critical on the VLED line,
which carries a high current.
either unfiltered or
unregulated power supply.
The Resistor, R1 together with
the capacitors, CX1 and CX2
acts as the low pass filter.
ASIC voltage supply or the V
supply. The capacitor, CX5
acts as the bypass capacitor.
board should be used to
provide sufficient ground
plane. Use the layer
underneath and near the
CC
CC
pin can be connected to
is connected to the
CC
• Top Layer: Connect the
• Layer 2: Critical ground
• Layer 3: Keep data bus
• Bottom layer: Ground
transceiver module as V
and sandwich that layer
between ground connected
board layers. The diagram
below demonstrate an
example of a 4 layer board:
metal shield and module
ground pin to bottom
ground layer;
Place the bypass capacitors
within 0.5cm from the V
and ground pin of the
module.
plane zone. 3 cm in all
direction around the
module. Connect to a
clean, noiseless ground
node (eg bottom layer).
away from critical ground
plane zone.
layer. Ground noise
<75 mVp-p. Should be
separated from ground
used by noisy sources.
CC
,
CC