HSDL-3021-021 Lite-On Electronics, HSDL-3021-021 Datasheet - Page 14

• Manufacturer Part Number: HSDL-3021-021
• Description: Infrared Transceivers IR Transceiver 4.0Mb/s
• Manufacturer: Lite-On Electronics

Specifications of HSDL-3021-021

• Wavelength: 885 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 10 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 40 ns, 600 ns
• Maximum Fall Time: 40 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 8 mm x 3 mm x 2.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Metal solder Stencil Aperture
It is recommended that only a 0.152 mm (0.006 inch) or
a 0.127 mm (0.005 inch) thick stencil be used for solder
paste printing. This is to ensure adequate printed solder
paste volume and no shorting. See Table 1 below the
drawing for combinations of metal stencil aperture and
metal stencil thickness that should be used. Aperture
opening for shield pad is 3.05 mm x 1.1 mm as per land
pattern.
Adjacent Land Keepout and Solder Mask Areas
Adjacent land keepout is the maximum space occupied
by the unit relative to the land pattern. There should be
no other SMD components within this area. The mini-
mum solder resist strip width required to avoid solder
bridging adjacent pads is 0.2 mm. It is recommended
that two fiducial crosses be placed at mid length of the
pads for unit alignment.
Note: Wet/Liquid Photo-imaginable solder resist/mask is recom-
mended.
14
h
SOLDER MASK
j
k
l
DIMENSION
h
l
k
j
Figure 3. Solder stencil aperture.
Table 1.
Stencil Thickness,
t (mm)
0.127 mm
0.11 mm
l
APERTURES AS PER
LAND DIMENSIONS
mm
0.2
3.0
3.85
10.1
Aperture Size(mm)
Length, l
1.75 ± 0.05
2.4 ± 0.05
w
Width, w
0.55 ± 0.05
0.55 ± 0.05
t