HCPL-2612#300 Avago Technologies US Inc., HCPL-2612#300 Datasheet - Page 5

High Speed Optocouplers 10MBd 1Ch 5mA

HCPL-2612#300

Manufacturer Part Number
HCPL-2612#300
Description
High Speed Optocouplers 10MBd 1Ch 5mA
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-2612#300

Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
50 mA
Maximum Fall Time
10 ns
Maximum Forward Diode Current
60 mA
Maximum Rise Time
24 ns
Output Device
Integrated Photo IC
Configuration
1 Channel
Maximum Baud Rate
10 MBps
Maximum Forward Diode Voltage
2.7 V
Maximum Reverse Diode Voltage
0.95 V
Maximum Power Dissipation
40 mW
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Package / Case
PDIP-8 Gull Wing
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-2612#300HCPL-2612
Manufacturer:
AVAGO
Quantity:
10 000
Company:
Part Number:
HCPL-2612#300
Manufacturer:
AGILENT
Quantity:
15 000
Company:
Part Number:
HCPL-2612#300E
Manufacturer:
AVAGO
Quantity:
10 000
Company:
Part Number:
HCPL-2612#300HCPL-2612#500
Manufacturer:
AGILENT
Quantity:
15 000
Company:
Part Number:
HCPL-2612#300HCPL-2612#500E
Manufacturer:
AVAGO
Quantity:
10 000
Solder Reflow Thermal Profile
TEMPERATURE
Recommended Pb-Free IR Profile
Insulation and Safety Related Specifications
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
5
Parameter
Min. External Air Gap
(External Clearance)
Min. External Tracking
Path (External Creepage)
Min. Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
Note: Non-halide flux should be used.
150 - 200 °C
Note: Non-halide flux should be used.
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
50
t
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
150°C, 90 + 30 SEC.
PREHEATING TIME
Symbol
TIME
L(I01)
L(I02)
CTI
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
p
Value
0.08
200
IIIa
7.1
7.4
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
Units
mm
mm
mm
V
SEC.
SEC.
30
30
50 SEC.
Conditions
Measured from input terminals to output terminals,
shortest distance through air.
Measured from input terminals to output terminals,
shortest distance path along body.
Through insulation distance, conductor to conductor,
usually the direct distance between the photoemitter
and photodetector inside the optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
Regulatory Information
The HCPL-2602/2612 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition Program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.

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