470-3105-100 Amphenol, 470-3105-100 Datasheet
470-3105-100
Specifications of 470-3105-100
Related parts for 470-3105-100
470-3105-100 Summary of contents
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... S0043 Replaced template format ‘E’ S0802 Updated copyright information Amphenol TCS 44 Simon Street Nashua, NH 03060 603.879.3000 AMPHENOL TCS TB-2082 Revision “E“ Specification Revision Status Initial Date J. Marvin 1/16/01 J. Proulx 10/19/01 J. Proulx 9/17/02 J ...
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... Vacuum “Pick-up” Cap Removal 9.0 Double Sided Reflow Process 10.0 Rework Process Addendums: A. NeXLev Connector Weights B. NeXLev DFM Check Sheet - used for design reviews, and process start-up. Copyright © Amphenol Corporation 2005-2008 • All rights reserved TB-2082 Revision “E“ Page ...
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... Customer Use Drawings C-471-1025-500 C-470-1075-500 471-1025-500 470-1075-500 1.4 Levels of Requirement For each requirement, an impact and benefit statement is included to quantify the requirement. Some requirements are stated as being recommended or preferred per the following: Recommended: The minimum processing requirement – a deviation will most likely impact manufacturability and cost. Preferred: Should be done when possible – ...
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... Mil) eutectic ball, re-flowed on the end of a formed pedestal. One wafer contains 10 signal and 9 g balls and the connector is provided in 10, 20, and 30 wafer configurations. Copyright © Amphenol Corporation 2005-2008 • All rights reserved round Ground Shield TB-2082 Revision “E“ ...
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... Copyright © Amphenol Corporation 2005-2008 • All rights reserved DFM Impact/Benefit • “Copper defined” better insures a round, accurately located pad – critical to part location tolerance. ...
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... DFM and SMT Assembly Guideline 3.2 Landing Pad Footprint Refer to customer drawings, C-471-1025-500 Plug and C-470-1075-500 Receptacle, for overall landing pad layout. See below for the detail of a single pad and via design. The exact landing pad and via design pad layout. See below for the detail of a single pad and via design. The exact landing pad and via design ...
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... Example – Differential Routing: two runs. *Note: the runs are parallel to the wafer – providing the most routing space. Trace Routing Details Copyright © Amphenol Corporation 2005-2008 • All rights reserved • Minimizes the risk of opens • Minimizes the risk of opens while allowing for other variables such as solder paste height and pad flatness* ...
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... Below are the total allowances for the connector design, and the recommended PCB fabrication tolerances. Total Connector Float Allowance Silkscreen outline – visible after component placement. Recommended PCB Footprint True Position Tolerance Copyright © Amphenol Corporation 2005-2008 • All rights reserved +/- 0.10mm Max error from nominal location X,Y TP < 0.10 mm From “D atum Point” ...
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... Connectors are placed in same orientation Preferred Mating and Un-Mating: Preferred Acceptable Copyright © Amphenol Corporation 2005-2008 • All rights reserved DFM Impact/Benefit • Ease of multi-board mating alignment • Maximizes designed-in “float” tolerances • Board tolerance exceeds connector max alignment tolerance. ...
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... Stacking Height Tolerance Matrix: http://www.Amphenol TCS.com/prods/tcs/docs/techbull/nexlev_stacking_height_tolerances.pdf Copyright © Amphenol Corporation 2005-2008 • All rights reserved DFM Impact/Benefit • Insure connectors stay mated during shipment and vibration. ...
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... Fragile Devices – Micro BGA, CGA, Leaded Fine Pitch, etc. 5mm Preferred clearance to fragile devices Copyright © Amphenol Corporation 2005-2008 • All rights reserved DFM Impact/Benefit • Rework nozzle - physical clearance • Prevents re-reflow of adjacent device, which could cause shorts/defects on that device. ...
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... Fine Pitch, etc. 5mm minimum preferred clearance to fragile devices Copyright © Amphenol Corporation 2005-2008 • All rights reserved DFM Impact/Benefit • Allow room/clearance for site cleaning and preparation, and manual paste application using micro stencil. • Prevents re-reflow of adjacent device, which could cause shorts/defects on that device. • ...
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... Improper handling can bend the compliant lead and result in ball locations outside of true position tolerances. One wafer contains 10 signal and 9 ground balls and the connector is provided in 10, 20, and 30 wafer configurations. Copyright © Amphenol Corporation 2005-2008 • All rights reserved Ground Shield TB-2082 Revision “E“ S-Bend ...
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... DFM and SMT Assembly Guideline 4.1 Connector Inspection NeXLev connectors are 100% laser inspected before leaving Amphenol TCS. Each ball is laser scanned and checked for radial true position, co-planarity and minimum ball-to-ball spacing. This is done using an automated 3-D laser inspection system. ...
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... This is the ball that was visually determined problem. Note: This is a picture of the connector placed on a glass template using a best-fit placement algorithm. The black circles represent the footprint pads. Copyright © Amphenol Corporation 2005-2008 • All rights reserved TB-2082 Revision “E“ the ball field. If Page ...
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... Molded Top Cover Bottom Pan and JEDEC Tray Copyright © Amphenol Corporation 2005-2008 • All rights reserved DFM Impact/Benefit • Protects the ball field until it can be loaded into the placement machine • ...
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... Stencil Thickness and Pad Finish Co-planarity Stencil Thickness and Paste Process Variation Copyright © Amphenol Corporation 2005-2008 • All rights reserved DFM Impact/Benefit • Most common – provides best adhesion for solder mask - preventing peeling and flaking of mask during assembly processes. ...
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... Camera Resolution - Less than 3 mil/pixel finer resolution cameras are recommended to better filter-out background issues Copyright © Amphenol Corporation 2005-2008 • All rights reserved DFM Impact/Benefit • Most accurate placement • Plastic housing to ball field tolerance stack-up will result in less than optimal placement accuracy • ...
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... Copyright © Amphenol Corporation 2005-2008 • All rights reserved The best-fit placement splits the difference The worse case solder balls are less than 25% off pad. Shorting risk is high on signal balls TB-2082 Revision “ ...
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... Amphenol TCS for more detailed SMT application instructions on taller NeXLev connectors Copyright © Amphenol Corporation 2005-2008 • All rights reserved DFM Impact/Benefit • Part can be presented within the camera’s focal plane, avoid part interferences with machine ...
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... Plug trays are blue, Receptacle trays are black Plug Copyright © Amphenol Corporation 2005-2008 • All rights reserved • Meets the requirements of industry standard placement equipment • See reflow process section for more info • The only size variation in the trays are slots that hold the connector ...
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... Tray Notch 135.90 (3X) 28.00 25.95 “ ...
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... NeXLev Assembled to PCB After First Reflow Copyright © Amphenol Corporation 2005-2008 • All rights reserved DFM Impact/Benefit • Insure even heat distribution across the part. • Insures against plastic over-heating and damage. ...
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... Pry Point • Lift housing off wafers parallel to the board surface • Solder joints are exposed to allow 100% visual inspection Copyright © Amphenol Corporation 2005-2008 • All rights reserved Pry Points • Spread wafers to reveal ball field TB-2082 Revision “E“ Page ...
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... Figure 1 1. Push cap to one side Plug Figure 2 Receptacle Copyright © Amphenol Corporation 2005-2008 • All rights reserved DFM Impact/Benefit • Vacuum cap can be removed after reflow/inspection. (Note: A new vacuum cap is required for connector rework) • By pulling the cap straight up from the connector, the ...
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... Note: The final decision to run NexLev connectors upside down, without any secondary method of retention, is with the customer. For more information on possible methods of retention – contact Amphenol TCS. Copyright © Amphenol Corporation 2005-2008 • All rights reserved DFM Impact/Benefit • Surface tension forces of the solder joint are greater than the weight/ball forces. • ...
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... Air-Vac http://www.air-vac-eng.com/nozzleconnector.htm SRT http://www.Amphenol TCS.com/prods/cbt/products/rework/prod_rework.html Copyright © Amphenol Corporation 2005-2008 • All rights reserved DFM Impact/Benefit • Achieves an all-ball reflow at point of removal without excessive heat to the connector and PCB, or insufficient heat causing lifted pads. • Insures against plastic over-heating and damage. ...
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... NeXLev RCPT, 200 posn 4702105100 10,5mm NeXLev RCPT, 200 posn 4702155100 15,5mm NeXLev RCPT, 200 posn 4702235100 23,5mm NeXLev RCPT, 200 posn 4703075100 7,5mm NeXLev RCPT, 300 posn 4703105100 10,5mm NeXLev RCPT, 300 posn 4703155100 15,5mm NeXLev RCPT, 300 posn 4703235100 ...
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... Manual placement not recommended • Use custom dedicated nozzles for the taller connectors. • Paste deposition should be 5-6 mils high and 21 mil diameter • “Flux-only” processing not recommended Copyright © Amphenol Corporation 2005-2008 • All rights reserved Check Change/Comments TB-2082 Revision “E“ ...