470-3105-100 Amphenol, 470-3105-100 Datasheet - Page 29

• Manufacturer Part Number: 470-3105-100
• Manufacturer: Amphenol
• Type: Backplaner

Specifications of 470-3105-100

• Gender: HDR
• Body Orientation: Straight
• Number Of Contact Rows: 4
• Number Of Contacts: 300POS
• Termination Method: Solder
• Mounting Style: Surface Mount
• Lead Free Status / RoHS Status: Compliant

PCB
Design
Inspection
Handling
Solder
Paste
Placement
Reflow
Double
Sided
Reflow
Rework
Item
Addendum “B”:
Copyright © Amphenol Corporation 2005-2008 • All rights reserved
3.4/ 3.5
3.3/6.0
Sect
10.0
4.0/
3.1
3.2
4.1
5.0
6.0
7.0
7.1
7.2
8.0
8.1
9.0
DFM and SMT Assembly Guideline
• Best-Fit placement is required
• Custom programming and nozzles may be required for
• When profiling, include thermal probe attachment to the
• Follow recommended process for vacuum cap removal.
• 15.5 and 23.5 will require verification in process.
• Placement with ball-field align and best-fit
• Manual placement not recommended
• Use custom dedicated nozzles for the taller connectors.
• Paste deposition should be 5-6 mils high and 21 mil
• “Flux-only” processing not recommended
• Stencil thickness is 6 mils – 5-mil thickness is acceptable.
• Stencil aperture should be 21 mils
• Copper defined .60mm (024”) pad – clear of solder mask
• Minimum .22mm (.009”) Solder Mask dam to Via, or via
• Specify board warp spec per process variables
• Multi connector orientation is the same
• Long side of connector is parallel across the larger spans
• Layout includes slightly oversized silkscreen outline of
• Manual component inspection not recommended
• Removal/replacement from JEDEC tray is not
• Handling process should include re-packaging and
• Set-up should include ball-field align, full circular side
• Follow solder paste manufacturer’s recommended
• All connectors up to and including 10.5mm tall, may
• When profiling, include thermal probe attachment to the
masking
connector.
recommended – minimize manual handling
handling pre-cautions.
lighting, and pre-orient align.
the taller connectors.
profile.
top of housing, to insure against plastic over-heating.
require verification in specific process.
top of housing, to insure against plastic over-heating.
diameter
DFM and Assembly Readiness Check Sheet
Check
Change/Comments
Page 29 of 29
Revision “E“
Who Status
TB-2082