MLG1005SR10JT TDK Corporation, MLG1005SR10JT Datasheet

INDUCTOR

MLG1005SR10JT

Manufacturer Part Number
MLG1005SR10JT
Description
INDUCTOR
Manufacturer
TDK Corporation
Series
MLG1005r
Datasheets

Specifications of MLG1005SR10JT

Rohs Compliant
YES
Inductance
100 nH
Tolerance
5 %
Maximum Dc Current
200 mAmps
Maximum Dc Resistance
2 Ohms
Self Resonant Frequency
0.9 GHz
Q Minimum
8
Operating Temperature Range
- 55 C to + 125 C
Termination Style
SMD/SMT
Package / Case
0402 (1005 metric)
Dimensions
0.5 mm W x 1 mm L x 0.5 mm H
Test Frequency
100 MHz
Lead Free Status / Rohs Status
 Details
Multilayer Chip Inductors
For High-frequency Circuits And Modules,
MLG
MLG Series 0603 type - Responding to the advanced design
needs of next-generation small digital device RF circuits.
The lineup of characteristics has been enhanced
in further refined and powerful ways.
The 0603 type has realized 100nH.
The industry's smallest size 0603 type (0.6 x 0.3 x
0.3mm) product has the industry's highest-level
inductance value of 100nH (at 100MHz).
This characteristic enhancement has allowed
replacement of almost all 1005 type (1.0 x 0.5 x
0.5mm) units for the choke integrated in the
RF circuits of small digital devices such as mo-
bile phones.
Plus, the products of the 1-10nH range have
been re-organized in a more detailed way.
Also, the lower limit of the inductance value
has been extended to 0.6nH from 1nH. Plus,
the product lineup for those 10nH or lower (1 to
5.6nH :
longed to the E12 series, has been segmenta-
lized to the E24 series (0.6 to 3.9nH :
to 5.6nH :
A single 0603 chip can set up the optimal in-
ductance value, allowing straightforward sim-
plification of the matching circuit.
allow lead-free soldering/high-temperature reflow processes.
The nickel + high-purity Sn gilding terminal electrodes
0.3nH/6.8 to 10nH :
0.3nH/6.2-10nH :
series
0603S
5%), which be-
5%).
0.2nH/4.3
TDK CORPORATION
type
The 0603
the dimension by 64% (68%, if imple-
mentation area, including the land
pattern, is considered), and of the
volume by 78% compared to the
1005
The advanced LTCC (Low Tempera-
ture Cofire Ceramic system) process,
which promotes further high induct-
ance and high Q, with optimized
sheet physical properties, low profil-
ing and multi layering, and finely
drawn internal conductor patterns, is
integrated with the super tiny chip,
establishing a processing technology
for highly stable mass production of
spiral internal conductors that's more
detailed and precise than the con-
ventional pattern formation accuracy.
type.
type allows reduction of
Internal structure
model
NEXT
A process-controlling technology has
been established to rigorously manage
characteristic parameters such as con-
ductor width, thickness, interlayer size,
terminal electrode distance, and so
forth, promoting a narrow tolerance
interval and low Rdc, as well as making
it a high inductance product.
Conforming to RoHS Directive
Conformity to RoHS Directive:
This means that, in conformity with EU
Directive 2002/95/EC, lead, cadmium,
mercury, hexavalent chromium, and
specific brominebased flame retardants,
PBB and PBDE, have not been used,
except for exempted applications.
2
Recommended
PC board pattern
(Reflow process)
A : 0.25 to 0.35 B : 0.2 to 0.3
C: 0.25 to 0.35
Shapes and
dimensions
MLG0603S
B
0.6 0.03
0.65 to 0.95
A
Weight : 0.2mg
Dimensions in mm
Dimensions in mm
0.2 min.
0.15 0.05
B
1

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