XC3S1600E-5FG320C Xilinx Inc, XC3S1600E-5FG320C Datasheet - Page 5

• Manufacturer Part Number: XC3S1600E-5FG320C
• Description: PROGRAMMABLE MICROCHIP
• Manufacturer: Xilinx Inc

Introduction and Ordering Information
Package Marking
Figure 2
FPGAs in the quad-flat packages.
marking for Spartan-3E FPGAs in BGA packages except
the 132-ball chip-scale package (CP132 and CPG132). The
markings for the BGA packages are nearly identical to those
for the quad-flat packages, except that the marking is
rotated with respect to the ball A1 indicator.
4
provides a top marking example for Spartan-3E
Figure 4: Spartan-3E CP132 and CPG132 Example Package Marking
Temperature Range
Temperature Range
Figure 3: Spartan-3E BGA Example Package Marking
Figure 2: Spartan-3E QFP Example Package Marking
Speed Grade
Device Type
Figure 3
Speed Grade
Device Type
BGA Ball A1
Package
Package
Mask Revision Code
Pin P1
Lot Code
Package
C5 = CP132
C6 = CPG132
Ball A1
Figure 4
shows the top
shows
www.xilinx.com
SPARTAN
XC3S250E
PQ208AGQ0525
D1234567A
4C
SPARTAN
XC3S250E
FT256AGQ0525
D1234567A
4C
F1234567-0525
PHILIPPINES
C5AGQ
the top marking for Spartan-3E FPGAs in the CP132 and
CPG132 packages.
Use the seven digits of the Lot Code to access additional
information for a specific device using the Xilinx web-based
Genealogy
3S250E
R
R
TM
Process Code
Fabrication Code
TM
R
R
4C
Viewer.
Device Type
Date Code
Temperature Range
Speed Grade
Mask Revision Code
Fabrication Code
Process Code
Date Code
Lot Code
Mask Revision Code
Fabrication Code
Process Technology
Date Code
Lot Code
DS312-1_05_032105
DS312-1_06_032105
DS312-1_02_032105
Advance Product Specification
DS312-1 (v1.1) March 21, 2005
R