AD7731BR-REEL Analog Devices Inc, AD7731BR-REEL Datasheet - Page 5

• Manufacturer Part Number: AD7731BR-REEL
• Description: IC,Data Acquisition Signal Conditioner,3-CHANNEL,24-BIT,SOP,24PIN,PLASTIC
• Manufacturer: Analog Devices Inc

Specifications of AD7731BR-REEL

• Rohs Status: RoHS non-compliant
• Number Of Bits: 24
• Sampling Rate (per Second): 6.4k
• Data Interface: DSP, Serial, SPI™
• Number Of Converters: 1
• Power Dissipation (max): 125mW
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.300", 7.50mm Width)
• For Use With: EVAL-AD7731EBZ - BOARD EVALUATION FOR AD7731

REV. A
ABSOLUTE MAXIMUM RATINGS*
(T
AV
AV
DV
DV
AGND to DGND ................................................ –5 V to +0.3 V
AV
Analog Input Voltage to AGND ........... –0.3 V to AV
Reference Input Voltage to AGND ....... –0.3 V to AV
AIN/REF IN Current (Indefinite) .................................... 30 mA
Digital Input Voltage to DGND ............ –0.3 V to DV
Digital Output Voltage to DGND ......... –0.3 V to DV
Output Voltage (D0, D1) to DGND ...... –0.3 V to AV
Operating Temperature Range
Industrial (B Version) ....................................... –40°C to +85°C
Storage Temperature Range ............................ –65°C to +150°C
Junction Temperature ..................................................... +150°C
ORDERING GUIDE
Model (Z = RoHS)
AD7731BN
AD7731BNZ
AD7731BR
AD7731BR-REEL
AD7731BR-REEL7
AD7731BRZ
AD7731BRZ-REEL
AD7731BRZ-REEL7
AD7731BRU
AD7731BRU-REEL
AD7731BRU-REEL7
AD7731BRUZ
AD7731BRUZ-REEL
AD7731BRUZ-REEL7
EVAL-AD7731EBZ
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
REV. A
A
= +25°C unless otherwise noted)
DD
DD
DD
DD
DD
to AGND .................................................. –0.3 V to +7 V
to DGND .................................................. –0.3 V to +7 V
to AGND .................................................. –0.3 V to +7 V
to DGND .................................................. –0.3 V to +7 V
to DV
DD
....................................................... –2 V to +5 V
Figure 1. Load Circuit for Access Time and Bus Relinquish Time
TO OUTPUT
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
PIN
DD
DD
DD
DD
DD
50pF
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
‐5‐
Package Description
24-Lead TSSOP
24-Lead PDIP
24-Lead PDIP
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead TSSOP
24-Lead TSSOP
24-Lead TSSOP
24-Lead TSSOP
24-Lead TSSOP
Evaluation Board
I
I
SINK
SOURCE
Plastic DIP Package, Power Dissipation ........................ 450 mW
θ
Lead Temperature (Soldering, 10 sec) ............................ +260°C
TSSOP Package, Power Dissipation .............................. 450 mW
θ
Lead Temperature, Soldering
Vapor Phase (60 sec) ...................................................... +215°C
Infrared (15 sec) ............................................................. +220°C
SOIC Package, Power Dissipation ................................ 450 mW
θ
Lead Temperature, Soldering
Vapor Phase (60 sec) ...................................................... +215°C
Infrared (15 sec) ............................................................ +220°C
*Stresses above those listed under Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only; functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
JA
JA
JA
(800µA AT DV
100µA AT DV
Thermal Impedance ............................................... 105°C/W
Thermal Impedance ............................................... 128°C/W
Thermal Impedance ................................................. 75°C/W
(200µA AT DV
100µA AT DV
+1.6V
DD
DD
= +5V
= +3V)
DD
DD
= +5V
= +3V)
Package Option
N-24-1
N-24-1
RW-24
RW-24
RW-24
RW-24
RW-24
RW-24
RU-24
RU-24
RU-24
RU-24
RU-24
RU-24
RoHS Compliant
No
Yes
No
No
No
Yes
Yes
Yes
No
No
No
Yes
Yes
Yes
Yes
AD7731