ADG1439BRUZ-REEL7 Analog Devices Inc, ADG1439BRUZ-REEL7 Datasheet - Page 10

• Manufacturer Part Number: ADG1439BRUZ-REEL7
• Description: ?15V,?5V,+12V ICMOS Diff 4:1 MUX With S
• Manufacturer: Analog Devices Inc
• Series: iCMOS®r

Specifications of ADG1439BRUZ-REEL7

• Function: Multiplexer
• Circuit: 2 x 4:1
• On-state Resistance: 21.5 Ohm
• Voltage Supply Source: Dual, Single, Dual Supply
• Voltage - Supply, Single/dual (±): ±5V, 12V, ±15V
• Current - Supply: 0.001µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADG1438/ADG1439
ABSOLUTE MAXIMUM RATINGS
T
Table 8.
Parameter
V
V
V
V
Analog Inputs
Digital Inputs
Continuous Current, Sx or
Peak Current, Sx or Dx Pins
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Reflow Soldering Peak
Time at Peak Temperature
1
Overvoltages at the analog and digital inputs are clamped by internal
diodes. Current should be limited to the maximum ratings given.
DD
DD
SS
L
A
Dx Pins
(Pulsed at 1 ms, 10% Duty
Industrial (B Version)
Temperature (Pb-Free)
to GND
= 25°C, unless otherwise noted.
to GND
to V
to GND
Cycle Max)
TSSOP
LFCSP
SS
1
1
Rating
35 V
−0.3 V to +25 V
+0.3 V to −25 V
−0.3 V to +7 V
V
30 mA, whichever occurs first
GND − 0.3 V to V
30 mA, whichever occurs first
Table 5 and Table 6 specifica-
tions + 15%
300 mA
400 mA
−40°C to +125°C
−65°C to +150°C
150°C
260(+0/−5)°C
10 sec to 40 sec
SS
− 0.3 V to V
DD
L
+ 0.3 V or
+ 0.3 V or
Rev. A | Page 10 of 20
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any one time.
THERMAL RESISTANCE
Table 9. Thermal Resistance
Package Type
20 Lead TSSOP (4-Layer Board)
20-Lead LFCSP (4-Layer Board and
ESD CAUTION
Exposed Paddle Soldered to V
SS
)
θ
112.6
30.4
JA
θ
50
N/A
JC
Unit
°C/W
°C/W