ADG1439BRUZ-REEL7 Analog Devices Inc, ADG1439BRUZ-REEL7 Datasheet - Page 20

• Manufacturer Part Number: ADG1439BRUZ-REEL7
• Description: ?15V,?5V,+12V ICMOS Diff 4:1 MUX With S
• Manufacturer: Analog Devices Inc
• Series: iCMOS®r

Specifications of ADG1439BRUZ-REEL7

• Function: Multiplexer
• Circuit: 2 x 4:1
• On-state Resistance: 21.5 Ohm
• Voltage Supply Source: Dual, Single, Dual Supply
• Voltage - Supply, Single/dual (±): ±5V, 12V, ±15V
• Current - Supply: 0.001µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADG1438/ADG1439
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG1438BRUZ
ADG1438BRUZ-REEL7
ADG1438BCPZ-REEL7
ADG1439BRUZ
ADG1439BRUZ-REEL7
ADG1439BCPZ-REEL7
1
©2009–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Temperature Range
−40°C to +125°C
−40°C to +125°C
INDICATOR
SEATING
PLANE
1.00
0.85
0.80
PIN 1
COPLANARITY
12° MAX
0.15
0.05
D08496-0-5/10(A)
PIN 1
Figure 38. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 37. 20-Lead Thin Shrink Small Outline Package [TSSOP]
0.10
TOP VIEW
BSC SQ
4.00
20
0.80 MAX
0.65 TYP
1
BSC
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
0.65
0.30
0.19
4 mm × 4 mm Body, Very Thin Quad (CP-20-4)
COMPLIANT TO JEDEC STANDARDS MO-153-AC
6.60
6.50
6.40
Dimensions shown in millimeters
Dimensions shown in millimeters
Package Description
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1.20 MAX
BSC SQ
3.75
0.20 REF
Rev. A | Page 20 of 20
0.05 MAX
0.02 NOM
11
10
SEATING
PLANE
COPLANARITY
(RU-20)
0.60 MAX
0.08
4.50
4.40
4.30
BSC
0.50
0.40
0.30
0.50
0.20
0.09
6.40 BSC
0.60 MAX
15
11
16
10
(BOTTOM VIEW)
EXPOSED
8°
0°
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
PAD
20
6
1
5
2.65
2.50 SQ
2.35
0.25 MIN
0.75
0.60
0.45
Package Option
RU-20
RU-20
CP-20-4
RU-20
RU-20
CP-20-4