ADSP-21062LKS-133 Analog Devices Inc, ADSP-21062LKS-133 Datasheet - Page 17

Digital Signal Processor(DSP) IC

ADSP-21062LKS-133

Manufacturer Part Number
ADSP-21062LKS-133
Description
Digital Signal Processor(DSP) IC
Manufacturer
Analog Devices Inc
Series
SHARC®r
Type
Floating Pointr

Specifications of ADSP-21062LKS-133

Rohs Status
RoHS non-compliant
Interface
Host Interface, Link Port, Serial Port
Clock Rate
33MHz
Non-volatile Memory
External
On-chip Ram
256kB
Voltage - I/o
3.30V
Voltage - Core
3.30V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
240-MQFP, 240-PQFP
Device Core Size
32b
Architecture
Super Harvard
Format
Floating Point
Clock Freq (max)
33MHz
Mips
33
Device Input Clock Speed
33MHz
Ram Size
256KB
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3.15V
Operating Supply Voltage (max)
3.45V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
240
Package Type
MQFP
Lead Free Status / Rohs Status
Not Compliant

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ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC
EXTERNAL POWER DISSIPATION (5 V)
Total power dissipation has two components, one due to inter-
nal circuitry and one due to the switching of external output
drivers. Internal power dissipation is dependent on the instruc-
tion execution sequence and the data operands involved.
Internal power dissipation is calculated in the following way:
The external component of total power dissipation is caused by
the switching of output pins. Its magnitude depends on:
and is calculated by:
The load capacitance should include the processor’s package
capacitance (CIN). The switching frequency includes driving
the load high and then back low. Address and data pins can
Table 5. External Power Calculations (5 V Devices)
Pin Type
Address
MS0
WR
Data
ADDRCLK
• the number of output pins that switch during each cycle
• the maximum frequency at which they can switch (f)
• their load capacitance (C)
• their voltage swing (V
P
P
INT
(O)
EXT
= I
= O u C u V
DDIN
u V
DD
DD
2
u f
No. of Pins
15
1
1
32
1
DD
)
% Switching
50
0
50
Rev. F | Page 17 of 64 | March 2008
u C
u 44.7 pF
u 44.7 pF
u 44.7 pF
u 14.7 pF
u 4.7 pF
drive high and low at a maximum rate of 1/(2t
strobe can switch every cycle at a frequency of 1/t
switch at 1/(2t
Example: Estimate P
The P
drive:
A typical power consumption can now be calculated for these
conditions by adding a typical internal power dissipation:
Note that the conditions causing a worst-case P
from those causing a worst-case P
occur while 100% of the output pins are switching from all ones
to all zeros. Note also that it is not common for an application to
have 100% or even 50% of the outputs switching
simultaneously.
• A system with one bank of external data memory RAM
• Four 128K u 8 RAM chips are used, each with a load of
• External data memory writes occur every other cycle, a rate
• The instruction cycle rate is 40 MHz (t
P
(32-bit)
10 pF
of 1/(4t
TOTAL
EXT
u f
u 10 MHz
u 10 MHz
u 20 MHz
u 10 MHz
u 20 MHz
equation is calculated for each class of pins that can
= P
CK
EXT
), with 50% of the pins switching
CK
), but selects can switch on each cycle.
+ (I
DDIN
EXT
2
with the following assumptions:
u 5.0 V)
u V
u 25 V
u 25 V
u 25 V
u 25 V
u 25 V
DD
2
INT
. Maximum P
= P
= 0.084 W
= 0.000 W
= 0.022 W
= 0.059 W
= 0.002 W
CK
= 25 ns)
EXT
CK
EXT
). The write
P
CK
INT
EXT
are different
. Select pins
cannot
= 0.167 W

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