ADSP-BF504BCPZ-4 Analog Devices Inc, ADSP-BF504BCPZ-4 Datasheet - Page 52

• Manufacturer Part Number: ADSP-BF504BCPZ-4
• Description: Low Cost Blackfin Wtih Processor Only
• Manufacturer: Analog Devices Inc
• Series: Blackfin®r
• Type: Fixed Pointr

Specifications of ADSP-BF504BCPZ-4

• Interface: CAN, EBI/EMI, I²C, IrDA, PPI, SPI, SPORT, UART/USART
• Clock Rate: 400MHz
• Non-volatile Memory: External
• On-chip Ram: 68kB
• Voltage - I/o: 1.8V, 2.5V, 3.3V
• Voltage - Core: 1.29V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: *
• Package / Case: *
• Rohs Compliant: YES
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADSP-BF504/ADSP-BF504F/ADSP-BF506F
Figure 47. Driver Type C Typical Rise and Fall Times (10%–90%) vs.
Figure 48. Driver Type C Typical Rise and Fall Times (10%–90%) vs.
Figure 49. Driver Type C Typical Rise and Fall Times (10%–90%) vs.
25
20
15
10
14
12
10
16
14
12
10
5
0
8
6
4
2
0
8
6
4
2
0
0
0
0
50
50
50
Load Capacitance (1.8 V V
Load Capacitance (2.5 V V
Load Capacitance (3.3 V V
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
100
100
100
t
RISE
DDEXT
DDEXT
DDEXT
150
150
150
)
)
)
t
t
RISE
FALL
t
t
t
t
t
t
RISE
RISE
FALL
t
t
FALL
RISE
FALL
RISE
FALL
t
FALL
= 1.8V @ 25
= 1.8V @ 25
= 3.3V @ 25
= 3.3V @ 25
= 2.5V @ 25
= 2.5V @ 25
Rev. 0 | Page 52 of 80 | December 2010
200
200
200
° C
° C
° C
° C
° C
° C
250
250
250
PROCESSOR—ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
where: T
T
ter of package.
P
for the method to calculate P
Values of
circuit board design considerations.
order approximation of T
where T
Values of
circuit board design considerations when an external heat sink
is required.
Values of
circuit board design considerations.
In
JEDEC standards JESD51-2 and JESD51-6, and the junction-to-
board measurement complies with JESD51-8. The junction-to-
case measurement complies with MIL-STD-883 (Method
1012.1). All measurements use a 2S2P JEDEC test board.
Table 43. Thermal Characteristics (88-Lead LFCSP)
Table 44. Thermal Characteristics (120-Lead LQFP)
Parameter
Parameter
D
CASE
JT
JA
JMA
JMA
JB
JC
JA
JMA
JMA
JB
JC
JT
JT
JT
JT
JT
JT
Table 43
= power dissipation (see
= from
= case temperature (°C) measured by customer at top cen-
A
J
= ambient temperature (°C)
= junction temperature (°C).
JA
JC
JB
Table 43
and
are provided for package comparison and printed
are provided for package comparison and printed
are provided for package comparison and printed
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
Table
T
J
T
and
=
J
44, airflow measurements comply with
=
T
Table
J
CASE
T
by the equation:
Total Power Dissipation on Page 29
A
D
).
+
44.
+
JA
JT
JA
P
can be used for a first
D
P
D
Typical
26.2
23.7
22.9
16.0
9.8
0.21
0.36
0.43
Typical
26.9
24.2
23.3
16.4
12.7
0.50
0.77
1.02
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W