CY7C1471V33-133AXC Cypress Semiconductor Corp, CY7C1471V33-133AXC Datasheet

SRAM (Static RAM)

CY7C1471V33-133AXC

Manufacturer Part Number
CY7C1471V33-133AXC
Description
SRAM (Static RAM)
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1471V33-133AXC

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
72M (2M x 36)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Density
72Mb
Access Time (max)
6.5ns
Sync/async
Synchronous
Architecture
SDR
Clock Freq (max)
133MHz
Operating Supply Voltage (typ)
3.3V
Address Bus
21b
Package Type
TQFP
Operating Temp Range
0C to 70C
Number Of Ports
4
Supply Current
305mA
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
100
Word Size
36b
Number Of Words
2M
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
428-2167
CY7C1471V33-133AXC

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1471V33-133AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
135
Part Number:
CY7C1471V33-133AXC
Manufacturer:
TOSHIBA
Quantity:
2 100
Part Number:
CY7C1471V33-133AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1471V33-133AXC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Part Number:
CY7C1471V33-133AXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
72-Mbit (2 M × 36/4 M × 18/1 M × 72) Flow-through SRAM with NoBL™ Architecture
Features
Note
Cypress Semiconductor Corporation
Document Number: 38-05288 Rev. *L
1. For best practice recommendations, refer to the Cypress application note
No Bus Latency™ (NoBL™) architecture eliminates dead
cycles between write and read cycles
Supports up to 133 MHz bus operations with zero wait states
Data is transferred on every clock
Pin compatible and functionally equivalent to ZBT™ devices
Internally self timed output buffer control to eliminate the need
to use OE
Registered inputs for flow through operation
Byte Write capability
3.3 V/2.5 V IO supply (V
Fast clock-to-output times
Clock enable (CEN) pin to enable clock and suspend operation
Synchronous self timed writes
Asynchronous output enable (OE)
CY7C1471V33, CY7C1473V33 available in JEDEC-standard
Pb-free 100-pin TQFP, Pb-free and non Pb-free 165-ball FBGA
package. CY7C1475V33 available in Pb-free and non Pb-free
209-ball FBGA package
Three chip enables (CE
expansion
Automatic power down feature available using ZZ mode or CE
deselect
IEEE 1149.1 JTAG Boundary Scan compatible
Burst capability — linear or interleaved burst order
Low standby power
6.5 ns (for 133-MHz device)
DDQ
1
, CE
)
2
, CE
Flow-through SRAM with NoBL™ Architecture
3
) for simple depth
198 Champion Court
72-Mbit (2 M × 36/4 M × 18/1 M × 72)
AN1064, SRAM System
Functional Description
The CY7C1471V33, CY7C1473V33 and CY7C1475V33 are
3.3 V, 2 M × 36/4 M × 18/1 M × 72 synchronous flow through burst
SRAMs designed specifically to support unlimited true
back-to-back read or write operations without the insertion of
wait
CY7C1475V33 are equipped with the advanced No Bus Latency
(NoBL) logic required to enable consecutive read or write
operations with data being transferred on every clock cycle. This
feature dramatically improves the throughput of data through the
SRAM, especially in systems that require frequent write-read
transitions.
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. The clock input is qualified by the
clock enable (CEN) signal, which when deasserted suspends
operation and extends the previous clock cycle.Maximum
access delay from the clock rise is 6.5 ns (133-MHz device).
Write operations are controlled by two or four byte write select
(BW
with on-chip synchronous self timed write circuitry.
Three synchronous chip enables (CE
asynchronous output enable (OE) provide for easy bank
selection and output tri-state control. To avoid bus contention,
the output drivers are synchronously tri-stated during the data
portion of a write sequence.
X
) and a write enable (WE) input. All writes are conducted
states.
San Jose
Guidelines.
The
,
CA 95134-1709
CY7C1471V33,
[1]
Revised September 21, 2010
CY7C1471V33
CY7C1473V33
CY7C1475V33
1
, CE
CY7C1473V33
2
, CE
408-943-2600
3
) and an
and
[+] Feedback

Related parts for CY7C1471V33-133AXC

CY7C1471V33-133AXC Summary of contents

Page 1

... Document Number: 38-05288 Rev. *L 72-Mbit (2 M × 36/4 M × 18/1 M × 72) Functional Description The CY7C1471V33, CY7C1473V33 and CY7C1475V33 are 3 × 36/4 M × 18/1 M × 72 synchronous flow through burst SRAMs designed specifically to support unlimited true back-to-back read or write operations without the insertion of wait states ...

Page 2

... Logic Block Diagram – CY7C1471V33 (2 M × 36) ADDRESS A0, A1, A REGISTER MODE CE CLK C CEN ADV/ READ LOGIC CE1 CE2 CE3 ZZ Logic Block Diagram – CY7C1473V33 (4 M × 18) ADDRESS A0, A1, A REGISTER MODE CE CLK ADV/ CE1 CE2 CE3 ZZ Document Number: 38-05288 Rev A1 A0 BURST ...

Page 3

... MODE CLK C CEN WRITE ADDRESS REGISTER 1 ADV/ READ LOGIC CE1 CE2 CE3 ZZ Sleep Control Document Number: 38-05288 Rev A1 A0' BURST D0 Q0 LOGIC ADV/LD C WRITE ADDRESS REGISTER 2 MEMORY WRITE DRIVERS WRITE REGISTRY AND DATA COHERENCY CONTROL LOGIC REGISTER 1 CY7C1471V33 CY7C1473V33 CY7C1475V33 ARRAY ...

Page 4

... TAP REGISTERS ...................................................... 16 TAP Instruction Set ................................................... 16 TAP Timing ...................................................................... 17 TAP AC Switching Characteristics ............................... 18 3.3 V TAP AC Test Conditions ....................................... 19 3.3 V TAP AC Output Load Equivalent ......................... 19 Document Number: 38-05288 Rev. *L CY7C1471V33 CY7C1473V33 CY7C1475V33 2.5 V TAP AC Test Conditions ....................................... 19 2.5 V TAP AC Output Load Equivalent ......................... 19 TAP DC Electrical Characteristics and Operating Conditions ..................................................... 19 Scan Register Sizes ...

Page 5

... Selection Guide Maximum access time Maximum operating current Maximum CMOS standby current Document Number: 38-05288 Rev. *L CY7C1471V33 CY7C1473V33 CY7C1475V33 133 MHz 117 MHz 6.5 8.5 305 275 120 120 Unit Page [+] Feedback ...

Page 6

... Pin Configurations DQP DDQ BYTE DDQ DDQ BYTE DDQ DQP 30 D Document Number: 38-05288 Rev. *L 100-pin TQFP Pinout CY7C1471V33 CY7C1471V33 CY7C1473V33 CY7C1475V33 80 DQP DDQ BYTE DDQ DDQ BYTE DDQ DQP A Page [+] Feedback ...

Page 7

... Pin Configurations (continued DDQ DDQ BYTE DDQ DQP DDQ Document Number: 38-05288 Rev. *L 100-pin TQFP Pinout CY7C1473V33 CY7C1471V33 CY7C1473V33 CY7C1475V33 DDQ DQP DDQ BYTE DDQ DDQ Page [+] Feedback ...

Page 8

... DDQ DDQ N DQP DDQ P NC/144M MODE NC/576M NC/1G A CE2 DDQ DDQ DDQ DDQ DDQ DDQ DDQ DDQ DDQ N DQP DDQ P NC/144M MODE A A Document Number: 38-05288 Rev. *L CY7C1471V33 (2 M × 36 CEN CLK TDO A TDI A0 A TCK TMS CY7C1473V33 (4 M × 18) ...

Page 9

... CEN DDQ DDQ DDQ MODE TDI CY7C1471V33 CY7C1473V33 CY7C1475V33 DQb DQb 3 BWS BWS DQb DQb b f BWS BWS DQb DQb DQb DQb DQPf DQPb DDQ DDQ V DQf V DQf DQf DQf DDQ DDQ V V DQf SS SS DQf V V DDQ DQf DQf DDQ NC ...

Page 10

... CE to select or deselect the device and CE to select or deselect the device and CE to select or deselect the device and DQP s is controlled by BW correspondingly CY7C1471V33 CY7C1473V33 CY7C1475V33 are placed in a tri-state condition.The X . During s or left floating selects DD Page [+] Feedback ...

Page 11

... connects. Not internally connected to the die. 144M, 288M, 576M, and 1G are address expansion pins and are not internally connected to the die. Functional Overview The CY7C1471V33, CY7C1473V33, and CY7C1475V33 are synchronous flow through burst SRAMs designed specifically to eliminate wait states during ...

Page 12

... OE. Burst Write Accesses The CY7C1471V33, CY7C1473V33, and CY7C1475V33 have an on-chip burst counter that enables the user to supply a single address and conduct up to four write operations without reasserting the address inputs. ADV/LD must be driven LOW to ...

Page 13

... Truth Table The truth table for CY7C1471V33, CY7C1473V33, CY7C1475V33 follows. Address Operation Used Deselect cycle None Deselect cycle None Deselect cycle None Continue deselect cycle None Read cycle External (begin burst) Read cycle Next (continue burst) NOP/dummy read External (begin burst) ...

Page 14

... Truth Table for Read/Write The read-write truth table for CY7C1471V33 follows. Function Read Write no bytes written Write byte A – (DQ and DQP ) A A Write byte B – (DQ and DQP ) B B Write byte C – (DQ and DQP ) C C Write byte D – (DQ and DQP ) D D Write all bytes Truth Table for Read/Write The read-write truth table for CY7C1473V33 follows ...

Page 15

... IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1471V33, CY7C1473V33, and CY7C1475V33 incorporate a serial boundary scan test access port (TAP). This port operates in accordance with IEEE Standard 1149.1-1990 but does not have the set of functions required for full 1149.1 compliance. These functions from the IEEE specification are excluded because their inclusion places an added delay in the critical speed path of the SRAM ...

Page 16

... Capture-DR state, an input or output may undergo a transition. The TAP may then try to capture a signal while in transition (metastable state). This does not harm the device, but CY7C1471V33 CY7C1473V33 CY7C1475V33 Page [+] Feedback ...

Page 17

... BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board. Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions TDIS t TDIH t TDOX DON’ UNDEFINED CY7C1471V33 CY7C1473V33 CY7C1475V33 TDOV Page [+] Feedback ...

Page 18

... Notes 12.t and t refer to the setup and hold time requirements of latching data from the boundary scan register 13.Test conditions are specified using the load in TAP AC Test Conditions. t Document Number: 38-05288 Rev. *L Description / ns CY7C1471V33 CY7C1473V33 CY7C1475V33 Min Max Unit 50 – ns – 20 MHz 20 – ...

Page 19

... DDQ I = 100 µ 3 DDQ V = 2.5 V DDQ V = 3.3 V DDQ V = 2.5 V DDQ V = 3.3 V DDQ V = 2.5 V DDQ GND < V < DDQ CY7C1471V33 CY7C1473V33 CY7C1475V33 to 2 1.25V 50Ω 50Ω 20pF O Min Max Unit 2.4 – V 2.0 – V 2.9 – V 2.1 – V – 0.4 V – 0.4 V – ...

Page 20

... Bit Size (× 36) Bit Size (× 18 Description CY7C1471V33 CY7C1473V33 CY7C1475V33 Description Describes the version number Reserved for internal use Defines memory type and architecture Defines width and density Enables unique identification of SRAM vendor Indicates the presence register Bit Size (× 72) ...

Page 21

... L10 59 B8 K11 60 A7 165-ball ID Bit # 165-ball L10 P6 28 K10 R6 29 J10 R8 30 H11 P3 31 G11 P4 32 F11 P8 33 E11 P9 34 D11 P10 35 C11 R9 36 A11 R10 37 A9 R11 38 B9 M10 39 A10 CY7C1471V33 CY7C1473V33 CY7C1475V33 Bit # 165-ball Bit # 165-ball ID 40 B10 ...

Page 22

... J11 V5 72 J10 U5 73 H11 U6 74 H10 W7 75 G11 V7 76 G10 U7 77 F11 V8 78 F10 V9 79 E10 W11 80 E11 W10 81 D11 V11 82 D10 V10 83 C11 U11 84 C10 CY7C1471V33 CY7C1473V33 CY7C1475V33 Bit # 209-ball ID 85 B11 86 B10 87 A11 88 A10 100 B3 101 C3 102 C4 103 ...

Page 23

... Max, device deselected, All Speeds  V  0.3 V, – 0 /2). Undershoot: V (AC) > –2 V (pulse width less than t CYC IL (min) within 200 ms. During this time V < V and CY7C1471V33 CY7C1473V33 CY7C1475V33 + 0 Ambient V V Temperature DD DDQ 0 C to +70 C 3.3 V– 2.5 V – 10 ...

Page 24

... EIA/JESD51 317  3 DDQ GND 351  INCLUDING JIG AND (b) SCOPE R = 1667  2 DDQ GND 1538  INCLUDING JIG AND (b) SCOPE CY7C1471V33 CY7C1473V33 CY7C1475V33 165 FBGA 209 BGA Unit Package Package ...

Page 25

... V of“AC Test Loads and Waveforms” on page and t is less than t to eliminate bus contention between SRAMs when sharing the same OELZ CHZ CLZ CY7C1471V33 CY7C1473V33 CY7C1475V33 = 3.3 V and is DDQ unless otherwise noted. 117 MHz Unit ...

Page 26

... CDV t DOH t OEV t CLZ D(A2+1) Q(A3) Q(A4) t OEHZ t OELZ READ READ BURST Q(A3) Q(A4) READ Q(A4+1) DON’T CARE UNDEFINED is LOW. When CE is HIGH HIGH CY7C1471V33 CY7C1473V33 CY7C1475V33 CHZ Q(A4+1) D(A5) Q(A6) D(A7) t DOH W RITE READ W RITE DESELECT D(A5) Q(A6) D(A7) is LOW HIGH ...

Page 27

... The IGNORE CLOCK EDGE or STALL cycle (Clock 3) illustrates CEN being used to create a pause. A write is not performed during this cycle. Document Number: 38-05288 Rev. *L [25, 26, 27 Q(A2) Q(A3) STALL READ WRITE STALL Q(A3) D(A4) DON’T CARE UNDEFINED is LOW. When CE is HIGH HIGH CY7C1471V33 CY7C1473V33 CY7C1475V33 CHZ D(A4) Q(A5) t DOH NOP READ DESELECT CONTINUE Q(A5) DESELECT is LOW HIGH Page ...

Page 28

... DQs are in high-Z when exiting ZZ sleep mode. Document Number: 38-05288 Rev. *L [28, 29] Figure 3. ZZ Mode Timing High-Z DON’T CARE “Truth Table” on page 13 for all possible signal conditions to deselect the device. CY7C1471V33 CY7C1473V33 CY7C1475V33 t ZZREC t RZZI DESELECT or READ Only Page [+] Feedback ...

Page 29

... To find the office closest to you, visit http://www.cypress.com/go/datasheet/offices. Speed Package (MHz) Ordering Code Diagram 133 CY7C1471V33-133AXC 51-85050 100-pin Thin Quad Flat Pack (14 × 20 × 1.4 mm) Pb-free Ordering Code Definitions CY7C 1471 V33 - 133 AX C Document Number: 38-05288 Rev. *L http://www.cypress.com/products ...

Page 30

... Package Diagrams Figure 4. 100-pin Thin Plastic Quad Flatpack (14 × 20 × 1.4 mm), 51-85050 Document Number: 38-05288 Rev. *L CY7C1471V33 CY7C1473V33 CY7C1475V33 51-85050 *C Page [+] Feedback ...

Page 31

... Package Diagrams (continued) Figure 5. 165-ball FBGA (15 × 17 × 1.4 mm), 51-85165 Document Number: 38-05288 Rev. *L CY7C1471V33 CY7C1473V33 CY7C1475V33 51-85165 *B Page [+] Feedback ...

Page 32

... Package Diagrams (continued) Figure 6. 209-ball FBGA (14 × 22 × 1.76 mm), 51-85167 Document Number: 38-05288 Rev. *L CY7C1471V33 CY7C1473V33 CY7C1475V33 51-85167 *A Page [+] Feedback ...

Page 33

... TCK test clock TMS test mode select TDI test data-in TDO test data-out TQFP thin quad flat pack WE write enable Document Number: 38-05288 Rev. *L CY7C1471V33 CY7C1473V33 CY7C1475V33 Document Conventions Units of Measure Symbol Unit of Measure ns nano seconds V Volts µA micro Amperes mA ...

Page 34

... Document History Page Document Title: CY7C1471V33/CY7C1473V33/CY7C1475V33, 72-Mbit (2 M × 36/4 M × 18/1 M × 72) Flow-through SRAM with NoBL™ Architecture Document Number: 38-05288 Submission REV. ECN NO. Orig. of Change Date ** 114675 08/06/02 *A 121521 02/07/03 *B 223721 See ECN *C 235012 See ECN *D 243572 See ECN ...

Page 35

... Document Title: CY7C1471V33/CY7C1473V33/CY7C1475V33, 72-Mbit (2 M × 36/4 M × 18/1 M × 72) Flow-through SRAM with NoBL™ Architecture Document Number: 38-05288 Submission REV. ECN NO. Orig. of Change Date *I 472335 See ECN *J 1274732 See ECN VKN/AESA *K 2898501 03/24/2010 *L 3034798 09/21/2010 Document Number: 38-05288 Rev. *L Description of Change ...

Page 36

... Document Number: 38-05288 Rev. *L NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device Technology, Inc. All products and company names mentioned in this document may be the trademarks of their respective holders. cypress.com/go/plc Revised September 21, 2010 CY7C1471V33 CY7C1473V33 CY7C1475V33 PSoC Solutions psoc.cypress.com/solutions ...

Related keywords