EVAL-ADXL346Z-M Analog Devices Inc, EVAL-ADXL346Z-M Datasheet - Page 38

• Manufacturer Part Number: EVAL-ADXL346Z-M
• Description: EB: Full Eval System Of ADXL346
• Manufacturer: Analog Devices Inc

Specifications of EVAL-ADXL346Z-M

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADXL346
LAYOUT AND DESIGN RECOMMENDATIONS
Figure 61 shows the recommended printed wiring board land pattern. Figure 62 and Table 27 provide details about the recommended
soldering profile.
Table 27. Recommended Soldering Profile
Profile Feature
Average Ramp Rate from Liquid Temperature (T
Preheat
T
Liquid Temperature (T
Time Maintained Above T
Peak Temperature (T
Time of Actual T
Ramp-Down Rate
Time 25°C to Peak Temperature
1
2
Based on JEDEC Standard J-STD-020D.1.
For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used.
SMAX
Minimum Temperature (T
Maximum Temperature (T
Time from T
to T
L
Ramp-Up Rate
SMIN
P
− 5°C (t
to T
P
)
SMAX
L
)
L
P
(t
)
(t
L
S
)
SMIN
)
SMAX
)
)
T
T
P
L
T
SMIN
Figure 61. Recommended Printed Wiring Board Land Pattern
1, 2
T
3.3500
SMAX
L
) to Peak Temperature (T
Figure 62. Recommended Soldering Profile
PREHEAT
(Dimensions shown in millimeters)
t
25°C TO PEAK
t
S
Rev. A | Page 38 of 40
RAMP-UP
3.3500
TIME
P
)
RAMP-DOWN
t
P
0.8000
t
L
0.3000
0.5000
CRITICAL ZONE
Sn63/Pb37
3°C/sec max
100°C
150°C
60 sec to 120 sec
3°C/sec max
183°C
60 sec to 150 sec
240 + 0/−5°C
10 sec to 30 sec
6°C/sec max
6 minutes max
T
L
TO T
P
Condition
Pb-Free
3°C/sec max
150°C
200°C
60 sec to 180 sec
3°C/sec max
217°C
60 sec to 150 sec
260 + 0/−5°C
20 sec to 40 sec
6°C/sec max
8 minutes max