BAS40-04,215 NXP Semiconductors, BAS40-04,215 Datasheet

DIODE SCHOTTKY 40V 120MA SOT23

BAS40-04,215

Manufacturer Part Number
BAS40-04,215
Description
DIODE SCHOTTKY 40V 120MA SOT23
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS40-04,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Voltage - Forward (vf) (max) @ If
1V @ 40mA
Current - Reverse Leakage @ Vr
10µA @ 40V
Current - Average Rectified (io) (per Diode)
120mA (DC)
Voltage - Dc Reverse (vr) (max)
40V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Diode Configuration
1 Pair Series Connection
Mounting Type
Surface Mount
Product
Schottky Diodes
Peak Reverse Voltage
40 V
Forward Continuous Current
0.12 A
Max Surge Current
0.2 A
Configuration
Dual Series
Forward Voltage Drop
1 V @ 0.04 A
Maximum Reverse Leakage Current
10 uA
Operating Temperature Range
+ 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-1602-2
933661850215
BAS40-04 T/R
1. Product profile
1.1 General description
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic
packages.
Table 1.
Type number
1PS70SB40
1PS76SB40
1PS79SB40
BAS40
BAS40H
BAS40L
BAS40W
1PS70SB44
BAS40-04
BAS40-04W
1PS70SB45
1PS75SB45
BAS40-05
BAS40-05W
1PS70SB46
BAS40-06
BAS40-06W
BAS40-07
BAS40-07V
BAS40-05V
1PS88SB48
BAS40XY
BAS40 series;
1PSxxSB4x series
General-purpose Schottky diodes
Rev. 08 — 13 January 2010
Product overview
SOT323
SOD323
SOD523
SOT23
SOD123F
SOD882
SOT323
SOT323
SOT23
SOT323
SOT323
SOT416
SOT23
SOT323
SOT323
SOT23
SOT323
SOT143B
SOT666
SOT666
SOT363
SOT363
Package
NXP
JEITA
SC-70
SC-76
SC-79
-
-
-
SC-70
SC-70
-
SC-70
SC-70
SC-75
-
SC-70
SC-70
-
SC-70
-
-
-
SC-88
SC-88
single diode
single diode
single diode
single diode
single diode
single diode
single diode
dual series
dual series
dual series
dual common cathode
dual common cathode
dual common cathode
dual common cathode
dual common anode
dual common anode
dual isolated
dual isolated
quadruple common cathode/
quadruple common cathode/
quadruple; 2 series
Configuration
dual common anode
common cathode
common cathode
Product data sheet

Related parts for BAS40-04,215

BAS40-04,215 Summary of contents

Page 1

... BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Rev. 08 — 13 January 2010 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number 1PS70SB40 1PS76SB40 1PS79SB40 BAS40 BAS40H BAS40L BAS40W 1PS70SB44 BAS40-04 BAS40-04W 1PS70SB45 1PS75SB45 BAS40-05 ...

Page 2

... Pinning information Table 3. Pin BAS40H; 1PS76SB40; 1PS79SB40 1 2 BAS40L 1 2 BAS40; BAS40W; 1PS70SB40 BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series Quick reference data Parameter Conditions forward current forward voltage reverse voltage ≤ 300 μs; δ ≤ 0.02. p Pinning Description cathode ...

Page 3

... BAS40- BAS40-07V BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series Pinning …continued Description anode (diode 1) cathode (diode 2) cathode (diode 1), anode (diode 2) anode (diode 1) anode (diode 2) cathode (diode 1), cathode (diode 2) cathode (diode 1) cathode (diode 2) anode (diode 1), anode (diode 2) cathode (diode 1) cathode (diode 2) ...

Page 4

... BAS40XY [1] The marking bar indicates the cathode. BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series Pinning …continued Description anode (diode 1) anode (diode 2) cathode (diode 3), cathode (diode 4) anode (diode 3) anode (diode 4) cathode (diode 1), cathode (diode 2) anode (diode 1) cathode (diode 2) anode (diode 3), ...

Page 5

... BAS40-05 BAS40-05W 1PS70SB46 BAS40-06 BAS40-06W BAS40-07 BAS40-07V BAS40-05V 1PS88SB48 BAS40XY BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series Ordering information Package Name Description SC-70 plastic surface-mounted package; 3 leads SC-76 plastic surface-mounted package; 2 leads SC-79 plastic surface-mounted package; 2 leads - plastic surface-mounted package; 3 leads - plastic surface-mounted package ...

Page 6

... Symbol Per diode FRM I FSM amb T stg = 25 °C prior to surge. [ BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series Marking codes [1] Marking code 6 43 63* 6*4 44* 64* 6*5 Limiting values Parameter Conditions reverse voltage forward current ≤ δ ≤ 0.5 repetitive peak forward ...

Page 7

... Table 8. ° amb Symbol Per diode [1] Pulse test: t BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series Thermal characteristics Parameter Conditions thermal resistance from in free air junction to ambient SOT23 SOT143B SOT363 (1PS88SB48) SOT416 SOT666 (BAS40-05V) SOT666 (BAS40-07V) SOD123F SOD323 SOD523 SOD882 SOT323 ...

Page 8

... T amb Fig 1. Forward current as a function of forward voltage; typical values dif (Ω − kHz Fig 3. Differential resistance as a function of forward current; typical values BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series mlc361 (μ −1 10 − (V) F (1) T (2) T (3) T Fig 2. ...

Page 9

... Dimensions in mm Fig 9. Package outline SOD882 BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 1.1 0.8 0.45 0.15 1.65 1.55 0.25 0.10 03-12-17 Dimensions in mm Fig 6. Package outline SOD523 (SC-79) 1.1 ...

Page 10

... Dimensions in mm Fig 11. Package outline SOT143B 1.8 1.4 3 1.75 0.9 1.45 0 Dimensions in mm Fig 13. Package outline SOT416 (SC-75) BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 1.1 0.9 3 0.45 0.15 2.2 1.35 2.0 1.15 2 0.48 0.15 0.38 0.09 Dimensions in mm 04-11-16 Fig 12 ...

Page 11

... For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series Packing methods Description SOT323 4 mm pitch tape and reel SOD323 4 mm pitch tape and reel SOD523 2 mm pitch tape and reel ...

Page 12

... Fig 15. Reflow soldering footprint SOD323 (SC-76) Dimensions in mm Fig 16. Wave soldering footprint SOD323 (SC-76) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 17. Reflow soldering footprint SOD523 (SC-79) BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 3.05 2.80 2.10 1.60 1.65 0.95 0.50 (2× ...

Page 13

... NXP Semiconductors Dimensions in mm Fig 18. Reflow soldering footprint SOT23 (TO-236AB) 4.60 4.00 Dimensions in mm Fig 19. Wave soldering footprint SOT23 (TO-236AB) BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 2.90 2. 0.85 3.00 1.30 0.85 3 0.50 (3x) 0.60 (3x) 1.00 3.30 3.40 1.20 (2x 1.20 3 2.80 4.50 Rev. 08 — ...

Page 14

... Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 20. Reflow soldering footprint SOD123F Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 21. Reflow soldering footprint SOD882 BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 4.4 4 2.9 1.6 1.6 1.1 (2×) 1. 0.05 (8× ...

Page 15

... NXP Semiconductors Fig 22. Reflow soldering footprint SOT323 (SC-70) 3.65 Fig 23. Wave soldering footprint SOT323 (SC-70) BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 2.65 0.75 1.325 1. 0.60 2.35 0.85 (3×) 1 0.55 (3×) 2.40 4.60 4.00 1. 2.10 1 preferred transport direction during soldering Rev. 08 — ...

Page 16

... NXP Semiconductors Dimensions in mm Fig 24. Reflow soldering footprint SOT143B Fig 25. Wave soldering footprint SOT143B BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 3.25 0.60 (3x) 0.50 (3x) 0.60 (4x 2. 0.90 1.00 2.50 4.45 1.20 (3× 1.00 preferred transport direction during soldering 3.40 Rev. 08 — 13 January 2010 ...

Page 17

... NXP Semiconductors 2.35 Fig 26. Reflow soldering footprint SOT363 (SC-88) 4.5 Fig 27. Wave soldering footprint SOT363 (SC-88) BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 2.65 1.5 0.6 0.5 (4×) (4×) 0.5 0.6 (4×) (2×) 0.6 (4×) 1.8 1.5 1.5 1.3 1.3 2 ...

Page 18

... NXP Semiconductors Fig 28. Reflow soldering footprint SOT416 2 1.7 1.075 Reflow soldering is the only recommended soldering method. Fig 29. Reflow soldering footprint SOT666 BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 2.2 0.6 0.7 3 2.0 0.85 0.6 (3x) 1.9 Dimensions in mm solder lands solder resist 2 ...

Page 19

... BAS40_SERIES_5 20011010 BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series Data sheet status Product data sheet This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. ...

Page 20

... Contact information For more information, please visit: For sales office addresses, please send an email to: BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series [3] Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. ...

Page 21

... Trademarks Contact information Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 BAS40 series; 1PSxxSB4x series Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com General-purpose Schottky diodes All rights reserved ...

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