BAS40,215 NXP Semiconductors, BAS40,215 Datasheet

DIODE SCHOTTKY 40V 120MA SOT-23

BAS40,215

Manufacturer Part Number
BAS40,215
Description
DIODE SCHOTTKY 40V 120MA SOT-23
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS40,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Voltage - Forward (vf) (max) @ If
1V @ 40mA
Voltage - Dc Reverse (vr) (max)
40V
Current - Average Rectified (io)
120mA (DC)
Current - Reverse Leakage @ Vr
10µA @ 40V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Capacitance @ Vr, F
5pF @ 0V, 1MHz
Mounting Type
Surface Mount
Product
Schottky Diodes
Peak Reverse Voltage
40 V
Forward Continuous Current
0.12 A
Max Surge Current
0.2 A
Configuration
Single
Forward Voltage Drop
1 V @ 0.04 A
Maximum Reverse Leakage Current
10 uA
Operating Temperature Range
+ 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4861-2
934034530215
BAS40 T/R
BAS40 T/R
BAS40,215
1. Product profile
1.1 General description
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic
packages.
Table 1.
Type number
1PS70SB40
1PS76SB40
1PS79SB40
BAS40
BAS40H
BAS40L
BAS40W
1PS70SB44
BAS40-04
BAS40-04W
1PS70SB45
1PS75SB45
BAS40-05
BAS40-05W
1PS70SB46
BAS40-06
BAS40-06W
BAS40-07
BAS40-07V
BAS40-05V
1PS88SB48
BAS40XY
BAS40 series;
1PSxxSB4x series
General-purpose Schottky diodes
Rev. 08 — 13 January 2010
Product overview
SOT323
SOD323
SOD523
SOT23
SOD123F
SOD882
SOT323
SOT323
SOT23
SOT323
SOT323
SOT416
SOT23
SOT323
SOT323
SOT23
SOT323
SOT143B
SOT666
SOT666
SOT363
SOT363
Package
NXP
JEITA
SC-70
SC-76
SC-79
-
-
-
SC-70
SC-70
-
SC-70
SC-70
SC-75
-
SC-70
SC-70
-
SC-70
-
-
-
SC-88
SC-88
single diode
single diode
single diode
single diode
single diode
single diode
single diode
dual series
dual series
dual series
dual common cathode
dual common cathode
dual common cathode
dual common cathode
dual common anode
dual common anode
dual isolated
dual isolated
quadruple common cathode/
quadruple common cathode/
quadruple; 2 series
Configuration
dual common anode
common cathode
common cathode
Product data sheet

Related parts for BAS40,215

BAS40,215 Summary of contents

Page 1

BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Rev. 08 — 13 January 2010 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number 1PS70SB40 1PS76SB40 1PS79SB40 BAS40 BAS40H BAS40L BAS40W ...

Page 2

... NXP Semiconductors 1.2 Features High switching speed High breakdown voltage 1.3 Applications Ultra high-speed switching 1.4 Quick reference data Table 2. Symbol Per diode [1] Pulse test Pinning information Table 3. Pin BAS40H; 1PS76SB40; 1PS79SB40 1 2 BAS40L 1 2 BAS40; BAS40W; 1PS70SB40 BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series ...

Page 3

... NXP Semiconductors Table 3. Pin BAS40-04; BAS40-04W; 1PS70SB44 BAS40-05; BAS40-05W; 1PS70SB45; 1PS75SB45 BAS40-06; BAS40-06W; 1PS70SB46 BAS40- BAS40-07V BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series Pinning …continued Description anode (diode 1) cathode (diode 2) cathode (diode 1), anode (diode 2) anode (diode 1) anode (diode 2) cathode (diode 1), ...

Page 4

... NXP Semiconductors Table 3. Pin BAS40-05V; 1PS88SB48 BAS40XY [1] The marking bar indicates the cathode. BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series Pinning …continued Description anode (diode 1) anode (diode 2) cathode (diode 3), cathode (diode 4) anode (diode 3) anode (diode 4) cathode (diode 1), cathode (diode 2) anode (diode 1) ...

Page 5

... NXP Semiconductors 3. Ordering information Table 4. Type number 1PS70SB40 1PS76SB40 1PS79SB40 BAS40 BAS40H BAS40L BAS40W 1PS70SB44 BAS40-04 BAS40-04W 1PS70SB45 1PS75SB45 BAS40-05 BAS40-05W 1PS70SB46 BAS40-06 BAS40-06W BAS40-07 BAS40-07V BAS40-05V 1PS88SB48 BAS40XY BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series Ordering information Package Name ...

Page 6

... NXP Semiconductors 4. Marking Table 5. Type number 1PS70SB40 1PS76SB40 1PS79SB40 BAS40 BAS40H BAS40L BAS40W 1PS70SB44 BAS40-04 BAS40-04W 1PS70SB45 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ...

Page 7

... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol Per device R th(j-a) R th(j-sp) [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Soldering point at pins and 6. 7. Characteristics Table 8. ° amb Symbol Per diode ...

Page 8

... NXP Semiconductors (mA) 10 (1) (2) (3) (4) 1 −1 10 − 0.2 0.4 0.6 = 125 °C (1) T amb = 85 °C (2) T amb = 25 °C (3) T amb = −40 °C (4) T amb Fig 1. Forward current as a function of forward voltage; typical values dif (Ω − kHz Fig 3. Differential resistance as a function of forward current ...

Page 9

... NXP Semiconductors 8. Package outline 1.35 1.15 1 2.7 1.8 2.3 1.6 2 0.40 0.25 Dimensions in mm Fig 5. Package outline SOD323 (SC-76) 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Fig 7. Package outline SOT23 (TO-236AB) 0.62 0.55 2 0.30 0.22 0.65 0.30 0.22 1 0.55 cathode marking on top side 0 ...

Page 10

... NXP Semiconductors 3.0 2.8 1.9 4 2.5 1.4 2.1 1.2 1 0.88 0.78 1.7 Dimensions in mm Fig 11. Package outline SOT143B 1.8 1.4 3 1.75 0.9 1.45 0 Dimensions in mm Fig 13. Package outline SOT416 (SC-75) BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 1.1 0.9 3 0.45 ...

Page 11

... NXP Semiconductors 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package 1PS70SB40 1PS76SB40 1PS79SB40 BAS40 BAS40H BAS40L BAS40W 1PS70SB44 BAS40-04 BAS40-04W 1PS70SB45 1PS75SB45 BAS40-05 BAS40-05W 1PS70SB46 BAS40-06 BAS40-06W BAS40-07 BAS40-07V BAS40-05V 1PS88SB48 ...

Page 12

... NXP Semiconductors 10. Soldering Dimensions in mm Fig 15. Reflow soldering footprint SOD323 (SC-76) Dimensions in mm Fig 16. Wave soldering footprint SOD323 (SC-76) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 17. Reflow soldering footprint SOD523 (SC-79) BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 3 ...

Page 13

... NXP Semiconductors Dimensions in mm Fig 18. Reflow soldering footprint SOT23 (TO-236AB) 4.60 4.00 Dimensions in mm Fig 19. Wave soldering footprint SOT23 (TO-236AB) BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 2.90 2. 0.85 3.00 1.30 0.85 3 0.50 (3x) 0.60 (3x) 1.00 3.30 3.40 1.20 (2x 1.20 3 2.80 4.50 Rev. 08 — ...

Page 14

... NXP Semiconductors 2.1 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 20. Reflow soldering footprint SOD123F Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 21. Reflow soldering footprint SOD882 BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 4.4 4 2.9 1 ...

Page 15

... NXP Semiconductors Fig 22. Reflow soldering footprint SOT323 (SC-70) 3.65 Fig 23. Wave soldering footprint SOT323 (SC-70) BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 2.65 0.75 1.325 1. 0.60 2.35 0.85 (3×) 1 0.55 (3×) 2.40 4.60 4.00 1. 2.10 1 preferred transport direction during soldering Rev. 08 — ...

Page 16

... NXP Semiconductors Dimensions in mm Fig 24. Reflow soldering footprint SOT143B Fig 25. Wave soldering footprint SOT143B BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 3.25 0.60 (3x) 0.50 (3x) 0.60 (4x 2. 0.90 1.00 2.50 4.45 1.20 (3× 1.00 preferred transport direction during soldering 3.40 Rev. 08 — 13 January 2010 ...

Page 17

... NXP Semiconductors 2.35 Fig 26. Reflow soldering footprint SOT363 (SC-88) 4.5 Fig 27. Wave soldering footprint SOT363 (SC-88) BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 2.65 1.5 0.6 0.5 (4×) (4×) 0.5 0.6 (4×) (2×) 0.6 (4×) 1.8 1.5 1.5 1.3 1.3 2 ...

Page 18

... NXP Semiconductors Fig 28. Reflow soldering footprint SOT416 2 1.7 1.075 Reflow soldering is the only recommended soldering method. Fig 29. Reflow soldering footprint SOT666 BAS40_1PSXXSB4X_SER_8 Product data sheet BAS40 series; 1PSxxSB4x series 2.2 0.6 0.7 3 2.0 0.85 0.6 (3x) 1.9 Dimensions in mm solder lands solder resist 2 ...

Page 19

... Product data sheet BAS40 series; 1PSxxSB4x series Data sheet status Product data sheet This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. Figure 12 “Package outline SOT363 Figure 16 “ ...

Page 20

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 21

... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 5 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 7 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Packing information . . . . . . . . . . . . . . . . . . . . 11 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 12 Legal information ...

Related keywords