BAS70-04,215 NXP Semiconductors, BAS70-04,215 Datasheet - Page 11

DIODE SCHOTTKY 70V 70MA SOT23

BAS70-04,215

Manufacturer Part Number
BAS70-04,215
Description
DIODE SCHOTTKY 70V 70MA SOT23
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS70-04,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Voltage - Forward (vf) (max) @ If
1V @ 15mA
Current - Reverse Leakage @ Vr
10µA @ 70V
Current - Average Rectified (io) (per Diode)
70mA (DC)
Voltage - Dc Reverse (vr) (max)
70V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Diode Configuration
1 Pair Series Connection
Mounting Type
Surface Mount
Product
Schottky Diodes
Peak Reverse Voltage
70 V
Forward Continuous Current
0.07 A
Max Surge Current
0.1 A
Configuration
Dual Series
Forward Voltage Drop
1 V @ 0.015 A
Maximum Reverse Leakage Current
10 uA
Operating Temperature Range
+ 150 C
Mounting Style
SMD/SMT
Rectifier Type
Schottky Diode
Peak Rep Rev Volt
70V
Avg. Forward Curr (max)
0.07A
Rev Curr
10uA
Peak Non-repetitive Surge Current (max)
0.1A
Forward Voltage
1V
Operating Temp Range
-65C to 150C
Package Type
TO-236AB
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-1605-2
934020800215
BAS70-04 T/R
NXP Semiconductors
10. Soldering
BAS70_1PS7XSB70_SER_9
Product data sheet
Fig 14. Reflow soldering footprint SOD323 (SC-76)
Fig 15. Wave soldering footprint SOD323 (SC-76)
Fig 16. Reflow soldering footprint SOD523 (SC-79)
Dimensions in mm
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.65
2.75
0.95
1.20
BAS70 series; 1PS7xSB70 series
Rev. 09 — 13 January 2010
0.50
(2×)
solder lands
solder resist
occupied area
solder paste
preferred transport direction during soldering
3.05
2.80
2.10
1.60
1.20
5.00
4.40
1.40
0.50
msa433
1.80
1.90
0.60
2.15
General-purpose Schottky diodes
msa415
0.30
0.40
0.50
mgs343
0.60
solder lands
solder resist
occupied area
solder paste
solder lands
solder resist
occupied area
© NXP B.V. 2010. All rights reserved.
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