BAS70-04,215 NXP Semiconductors, BAS70-04,215 Datasheet - Page 16

• Manufacturer Part Number: BAS70-04,215
• Description: DIODE SCHOTTKY 70V 70MA SOT23
• Manufacturer: NXP Semiconductors

Specifications of BAS70-04,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 1V @ 15mA
• Current - Reverse Leakage @ Vr: 10µA @ 70V
• Current - Average Rectified (io) (per Diode): 70mA (DC)
• Voltage - Dc Reverse (vr) (max): 70V
• Diode Type: Schottky
• Speed: Small Signal =< 200mA (Io), Any Speed
• Diode Configuration: 1 Pair Series Connection
• Mounting Type: Surface Mount
• Product: Schottky Diodes
• Peak Reverse Voltage: 70 V
• Forward Continuous Current: 0.07 A
• Max Surge Current: 0.1 A
• Configuration: Dual Series
• Forward Voltage Drop: 1 V @ 0.015 A
• Maximum Reverse Leakage Current: 10 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Rectifier Type: Schottky Diode
• Peak Rep Rev Volt: 70V
• Avg. Forward Curr (max): 0.07A
• Rev Curr: 10uA
• Peak Non-repetitive Surge Current (max): 0.1A
• Forward Voltage: 1V
• Operating Temp Range: -65C to 150C
• Package Type: TO-236AB
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-1605-2; 934020800215; BAS70-04 T/R

NXP Semiconductors
BAS70_1PS7XSB70_SER_9
Product data sheet
Fig 25. Reflow soldering footprint SOT363 (SC-88)
Fig 26. Wave soldering footprint SOT363 (SC-88)
4.5
Dimensions in mm
solder lands
solder resist
occupied area
solder paste
1.3
BAS70 series; 1PS7xSB70 series
Rev. 09 — 13 January 2010
2.45
5.3
2.35
1.3
0.50
(4×)
0.50
(4×)
1.5
1.5
0.3
2.65
1.20
2.40
2.5
General-purpose Schottky diodes
0.60
(2×)
MSA432
0.40
(2×)
direction during soldering
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
preferred transport
0.90 2.10
solder lands
solder resist
occupied area
sot363_fw
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