LM3674MFX-1.2 National Semiconductor, LM3674MFX-1.2 Datasheet - Page 4

• Manufacturer Part Number: LM3674MFX-1.2
• Description: IC,SMPS CONTROLLER,VOLTAGE-MODE,TSOP,5PIN,PLASTIC
• Manufacturer: National Semiconductor

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V
V
I
I
R
R
I
V
V
I
F
SHDN
Q
LIM
EN
OSC
FB
REF
DSON (P)
DSON (N)
IH
IL
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Electrical Characteristics
type apply over the full operating junction temperature range (−30˚C ≤ T
apply to the LM3674 with V
Symbol
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin (MIL-STD-883 3015.7). National Semiconductor recommends that all intergrated circuits be handled with appropriate precautions. Failure to
observe proper ESD handling techniques can result in damage.
Note 4: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
130˚C
Note 5: In Applications where high power dissipation and /or poor package resistance is present, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (T
the application (P
(θ
Note 6: Junction to ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation exists, special care
must be given to thermal dissipation issues in board design. Value specified here 250˚C/W is based on measurement results using a 2 layer, 4" X 3", 2 oz. Cu board
as per JEDEC standards. The (θ
Note 7: For the ADJ version the resistor dividers should be selected such that at the desired output voltage, the voltage at the FB pin is 0.5V.
Note 8: Refer to datasheet curves for closed loop data and its variation with regards to supply voltage and temperature. Electrical Characteristic table reflects open
loop data (FB=0V and current drawn from SW pin ramped up until cycle by cycle current limit is activated). Closed loop current limit is the peak inductor current
measured in the application circuit by increasing output current until output voltage drops by 10%.
Note 9: Min and Max limits are guaranteed by design, test or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 10: The parameters in the electrical characteristic table are tested at V
to datasheet curves.
V
EN, FB, SW Pin:
Continuous Power Dissipation
Junction Temperature (T
Storage Temperature Range
Maximum Lead Temperature
(Soldering, 10 sec.)
ESD Rating (Note 3)
Human Body model: All Pins
Machine Model: All Pins
JA
IN
x P
Pin: Voltage to GND
D-MAX
). Refer to Dissipation ration table for P
Feedback Voltage (Note 12, 13)
Line Regulation
Load Regulation
Internal Reference Voltage
Shutdown Supply Current
DC Bias Current into V
Pin-Pin Resistance for PFET
Pin-Pin Resistance for NFET
Switch Peak Current Limit
Logic High Input
Logic Low Input
Enable (EN) Input Current
Internal Oscillator Frequency
D-MAX
) and the junction to ambient thermal resistance of the package (θ
Parameter
J-MAX
JA
A-MAX
) is 130˚C/W if a 4 layer, 4" X 3", 2/1/1/2 oz. Cu board as per JEDEC standards is used.
IN
= EN = 3.6V
)
) is dependent on the maximum operating junction temperature (T
IN
Internally Limited
−65˚C to +150˚C
D-MAX
(GND−0.2V) to
(Notes 2, 9, 10) Limits in standard typeface are for T
−0.2V to 6.0V
(V
values at different ambient temperatures.
(Note 1)
IN
I
2.7V ≤ V
I
100 mA ≤ I
V
(Note 7)
EN = 0V
No load, device is not
switching (FB=0V)
I
I
Open Loop (Note 8)
PWM Mode
O
O
SW
SW
IN
+ 0.2V)
+125˚C
= 10mA
= 100 mA
260˚C
200V
= 3.6V
= 200mA
= 200mA
2 kV
IN
IN
Condition
O
≤ 5.5V
= 3.6V unless otherwise specified. For performance over the input voltage range refer
4
≤ 600 mA
Operating Ratings
Thermal Properties
Junction-to-Ambient
Thermal Resistance (θ
(SOT23-5) for a 2 layer
board (Note 6)
250˚C/W
Input Voltage Range (Note 11)
Recommended Load Current
Junction Temperature (T
Ambient Temperature (T
JA
) in the application, as given by the following equation: T
J
≤ 125˚C). Unless otherwise noted, specifications
J-MAX
Min
830
1.0
1.6
-4
), the maximum power dissipation of the device in
JA
)
A
J
) Range
) Range
0.0010
J
0.083
1020
0.01
0.01
Typ
= 150˚C (typ.) and disengages at T
300
380
250
J
0.5
Junction-to-Ambient
Thermal Resistance (θ
(SOT23-5) for a 4 layer
board (Note 6)
130˚C/W
2
(Notes 1, 2)
= 25˚C. Limits in boldface
−30˚C to +125˚C
1200
Max
600
500
400
−30˚C to +85˚C
0.4
2.6
+4
1
1
0A to 600 mA
2.7V to 5.5V
A-MAX
= T
%/mA
Units
JA
MHz
%/V
mΩ
mΩ
mA
µA
µA
µA
%
J-MAX
V
V
V
)
J
=
-