MR3025 ON Semiconductor, MR3025 Datasheet
MR3025
Specifications of MR3025
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MR3025 Summary of contents
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... MICRODE BUTTON CASE 193 MARKING DIAGRAM 2525 LYYWW 2525 = Device Code L = Location Code YY = Year WW = Work Week MARKING DIAGRAM MR3025 YYWWL MR3025 = Device Code L = Location Code YY = Year WW = Work Week ORDERING INFORMATION Device Package Shipping Microde Button 5000 Units/Box Microde Button 5000 Units/Box ...
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... Instantaneous Forward Voltage (Note 1 100 Amps (1) Reverse Current (V = 250 250 100 Forward Voltage Temperature Coefficient @ I 1. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2%. *Typical TRA2525 MR3025 Characteristic = http://onsemi.com 2 Symbol Value Unit R 1.0 C/W JC Symbol Min Max Unit V — 1.18 Volts ...
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... INSTANTANEOUS FORWARD CURRENT (A) F Figure 1. Forward Voltage FAV 120 130 140 150 160 T , CASE TEMPERATURE ( C) C Figure 4. Current Derating TRA2525 MR3025 1000 175 C J 100 1 NUMBER OF CYCLES Figure 2. Non–Repetitive Surge Current 0 –0.5 Typical Range –1.0 –1.5 –2.0 100 200 0 INSTANTANEOUS FORWARD CURRENT (A) F Figure 3 ...
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... where: r(t) = normalized value of transient thermal resistance at time, t, from Figure 6, i.e.: r normalized value of transient thermal resistance time 0 FORWARD CURRENT (A) F Figure 8. Forward Recovery Time TRA2525 MR3025 TIME (ms) Figure 6. Thermal Response / 1000 is peak 100 10 0.1 ) – r 100 RATIO OF REVERSE TO FORWARD CURRENT ...
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... For a sine wave input Vm sin(wt) to the diode, assume lossless, the maximum theoretical efficiency factor becomes 100 100% + 40. (sine TRA2525 MR3025 square wave input sine wave input FREQUENCY (kHz) Figure 10. Rectification Waveform Efficiency RECTIFICATION EFFICIENCY NOTE RS shown in Figure 10 For a square wave input of amplitude Vm, the efficiency factor becomes: (1) 2 (dc) V ...
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... Newton Torsion 6–inch lbs. 0.68 Newtons–meters Shear 55 lbs. 244.7 Newton TRA2525 MR3025 MECHANICAL STRESS COMPRESSION TENSION Exceeding these recommended maximums can result in electrical degradation of the device. Soldering The button rectifier is basically a semiconductor chip bonded between two nickel–plated copper heat sinks with an encapsulating material of epoxy compound ...
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... This is the most economical labor method of soldering large volumes. Flame soldering offers good temperature TRA2525 MR3025 control but requires sophisticated temperature monitoring systems such as infrared. 3. Ovens are good for batch soldering and are production limited ...
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... French Phone: (+1) 303–308–7141 (Mon–Fri 2:00pm to 7:00pm CET) Email: ONlit–french@hibbertco.com English Phone: (+1) 303–308–7142 (Mon–Fri 12:00pm to 5:00pm GMT) Email: ONlit@hibbertco.com EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781 *Available from Germany, France, Italy, UK, Ireland TRA2525 MR3025 PACKAGE DIMENSIONS CASE 193–04 ISSUE ...