MR3025 ON Semiconductor, MR3025 Datasheet - Page 6

• Manufacturer Part Number: MR3025
• Description: DIODE FAST REC 25A 250V BUTTON
• Manufacturer: ON Semiconductor

Specifications of MR3025

• Voltage - Forward (vf) (max) @ If: 1.18V @ 100A
• Voltage - Dc Reverse (vr) (max): 250V
• Current - Average Rectified (io): 25A
• Current - Reverse Leakage @ Vr: 10µA @ 250V
• Diode Type: Standard
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Mounting Type: Surface Mount
• Package / Case: Microde Button
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Reverse Recovery Time (trr): -
• Capacitance @ Vr, F: -

Assembly and Soldering Information
implementation of button rectifiers:
Each should be carefully examined before attempting a
finished assembly or mounting operation.
Mounting and Handling
arrangements, but one key consideration must always be
included: One Side of the Connections to the Button Must
be Flexible!
maximum contact area to afford the best heat transfer — but
not at the expense of flexibility. For an annealed copper
terminal a thickness of 0.015 is suggested.
shape and size are a function of the individual application
and the heat transfer requirements.
gentle to minimize sharp impact shocks and avoid nicking
of the plastic. Improperly designed automatic handling
equipment is the worst source of unnecessary shocks.
Techniques for vacuum handling and spring loading should
be investigated.
follows:
Compression
Tension
Torsion
Shear
Aluminum
Common
Materials
There are two basic areas of consideration for successful
The button rectifier lends itself to a multitude of assembly
This stress relief to the button should also be chosen for
The base heat sink may be of various materials whose
Handling of the button during assembly must be relatively
The mechanical stress limits for the button diode are as
Copper
1. Mounting and Handling
2. Soldering
Steel
32 lbs.
32 lbs.
6–inch lbs.
55 lbs.
Low Cost: relatively low heat conductivity
High Cost: high heat conductivity
Medium Cost: medium heat conductivity.
Relatively expensive to plate and not all
platers can process aluminum.
Strain Relief Terminal
for Button Rectifier
Advantages and Disadvantages
(Heat Sink Material)
Copper
Terminal
Button
Base
142.3 Newton
142.3 Newton
0.68 Newtons–meters
244.7 Newton
TRA2525 MR3025
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electrical degradation of the device.
Soldering
bonded between two nickel–plated copper heat sinks with an
encapsulating material of epoxy compound. The exposed
metal areas are also tin plated to enhance solderability.
temperature not exceed 260 C if device damage is to be
avoided. Various solder alloys can be used for this operation
but two types are recommended for best results:
contains both the metal and flux and can be dispensed
rapidly. The solder preform requires the application of a flux
to assure good wetting of the solder. The type of flux used
depends upon the degree of cleaning to be accomplished and
is a function of the metal involved. These fluxes range from
a mild rosin to a strong acid; e.g., Nickel plating oxides are
best removed by an acid base flux while an activated rosin
flux may be sufficient for tin plated parts.
tendency for it to float when the solder becomes liquid. To
prevent bad joints and misalignment, it is suggested that a
weighting or spring loaded fixture be employed. It is also
important that severe thermal shock (either heating or
cooling) be avoided as it may lead to damage of the die or
encapsulant of the part.
COMPRESSION
Exceeding these recommended maximums can result in
The button rectifier is basically a semiconductor chip
In the soldering process it is important that the
Solder is available as preforms or paste. The paste
Since the button is relatively lightweight, there is a
1. 95% Sn, 5% Sb; melting point 237 C
2. 96.5% tin, 3.5% silver; melting point 221 C
3. 63% tin, 37% lead; melting point 183 C
TENSION
MECHANICAL STRESS
TORSION
SHEAR