MC100EP11DR2 ON Semiconductor, MC100EP11DR2 Datasheet - Page 2

no-image

MC100EP11DR2

Manufacturer Part Number
MC100EP11DR2
Description
Clock Buffer 3.3V/5V ECL 1:2 Diff
Manufacturer
ON Semiconductor
Datasheet

Specifications of MC100EP11DR2

Number Of Outputs
4
Max Input Freq
3000 MHz
Propagation Delay (max)
0.27 ns
Supply Voltage (max)
+/- 5.5 V
Supply Voltage (min)
+/- 3 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Package / Case
SOIC-8 Narrow
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC100EP11DR2G
Manufacturer:
TI
Quantity:
1 940
Part Number:
MC100EP11DR2G
Manufacturer:
ON/安森美
Quantity:
20 000
Figure 1. 8−Lead Pinout (Top View) and Logic Diagram
Q1
Q0
Q1
Q0
1
2
3
4
Table 2. ATTRIBUTES
1. For additional information, see Application Note AND8003/D.
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Flammability Rating
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Characteristics
R
R
R
http://onsemi.com
1
1
2
Oxygen Index: 28 to 34
Charged Device Model
8
7
6
5
Human Body Model
Machine Model
2
V
D
D
V
CC
EE
TSSOP−8
SOIC−8
DFN8
* Pins will default LOW when left open.
** Pins will default to high when left open.
Table 1. PIN DESCRIPTION
Q0, Q0, Q1, Q1
V
EP
PIN
D*, D**
V
EE
CC
Pb Pkg
Level 1
Level 1
Level 1
UL 94 V−0 @ 0.125 in
73 Devices
37.5 kW
> 200 V
> 4 kV
> 2 kV
Value
75 kW
FUNCTION
ECL Data Inputs
ECL Data Outputs
Positive Supply
Negative Supply
(DFN8 only) Thermal
exposed pad must be
connected to a sufficient
thermal conduit. Electrically
connect to the most negative
supply (GND) or leave
unconnected, floating open.
Pb−Free Pkg
Level 1
Level 3
Level 1

Related parts for MC100EP11DR2