MC100EP11DR2 ON Semiconductor, MC100EP11DR2 Datasheet - Page 3

• Manufacturer Part Number: MC100EP11DR2
• Description: Clock Buffer 3.3V/5V ECL 1:2 Diff
• Manufacturer: ON Semiconductor

Specifications of MC100EP11DR2

• Number Of Outputs: 4
• Max Input Freq: 3000 MHz
• Propagation Delay (max): 0.27 ns
• Supply Voltage (max): +/- 5.5 V
• Supply Voltage (min): +/- 3 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Package / Case: SOIC-8 Narrow
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
3. Input and output parameters vary 1:1 with V
4. All loading with 50 W to V
5. V
Table 3. MAXIMUM RATINGS
Table 4. 10EP DC CHARACTERISTICS, PECL
Symbol
Symbol
V
V
V
I
T
T
q
q
q
q
q
T
q
I
V
V
V
V
V
I
I
out
EE
IH
IL
A
stg
JA
JC
JA
JC
JA
sol
JC
CC
EE
I
OH
OL
IH
IL
IHCMR
input signal.
IHCMR
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
min varies 1:1 with V
PECL Mode Power Supply
NECL Mode Power Supply
PECL Mode Input Voltage
NECL Mode Input Voltage
Output Current
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Wave Solder
Thermal Resistance (Junction−to−Case)
Negative Power Supply Current
Output HIGH Voltage (Note 4)
Output LOW Voltage (Note 4)
Input HIGH Voltage (Single−Ended)
Input LOW Voltage (Single−Ended)
Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 5)
Input HIGH Current
Input LOW Current
Characteristic
CC
Parameter
EE
− 2.0 V.
, V
IHCMR
max varies 1:1 with V
CC
. V
Pb−Free
EE
D
D
V
can vary +0.3 V to −2.2 V.
Pb
CC
2165
1365
2090
1365
−150
Min
http://onsemi.com
2.0
0.5
20
= 3.3 V, V
V
V
V
V
Continuous
Surge
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
(Note 2)
EE
CC
EE
CC
CC
Condition 1
−40°C
= 0 V
= 0 V
= 0 V
= 0 V
2290
1490
. The V
Typ
29
3
EE
IHCMR
= 0 V (Note 3)
2415
1615
2415
1690
Max
150
3.3
37
range is referenced to the most positive side of the differential
2230
1430
2155
1430
−150
Min
2.0
0.5
20
V
V
SOIC−8
SOIC−8
SOIC−8
TSSOP−8
TSSOP−8
TSSOP−8
DFN8
DFN8
DFN8
I
I
v V
w V
Condition 2
25°C
2355
1555
CC
EE
Typ
30
2480
1680
2480
1755
Max
150
3.3
39
2290
1490
2215
1490
−150
Min
2.0
0.5
22
−65 to +150
−40 to +85
41 to 44
41 to 44
35 to 40
Rating
85°C
2415
1615
100
190
130
185
140
129
265
265
Typ
−6
−6
50
84
31
6
6
2540
1740
2540
1815
Max
150
3.3
40
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
mA
mA
Unit
°C
°C
°C
mA
mV
mV
mV
mV
V
V
V
V
mA
mA
V