MC10EP32DT ON Semiconductor, MC10EP32DT Datasheet - Page 10
MC10EP32DT
Manufacturer Part Number
MC10EP32DT
Description
Clock Drivers & Distribution 3.3V/5V ECL Divide
Manufacturer
ON Semiconductor
Datasheet
1.MC10EP32D.pdf
(11 pages)
Specifications of MC10EP32DT
Mounting Style
SMD/SMT
Package / Case
TSSOP-8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC10EP32DT
Manufacturer:
ON
Quantity:
4 800
Part Number:
MC10EP32DT
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
MC10EP32DTG
Manufacturer:
ON Semiconductor
Quantity:
135
Company:
Part Number:
MC10EP32DTG
Manufacturer:
ON Semiconductor
Quantity:
174
0.15 (0.006) T
0.15 (0.006) T
−T−
0.10 (0.004)
SEATING
PLANE
L
U
U
S
S
PIN 1
IDENT
D
2X
L/2
C
8
1
−V−
A
8x
4
5
K
G
0.10 (0.004)
REF
−U−
B
PACKAGE DIMENSIONS
PLASTIC TSSOP PACKAGE
http://onsemi.com
M
CASE 948R−02
T
DT SUFFIX
U
TSSOP−8
DETAIL E
ISSUE A
S
10
DETAIL E
V
S
F
0.25 (0.010)
M
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
5. TERMINAL NUMBERS ARE SHOWN FOR
6. DIMENSION A AND B ARE TO BE DETERMINED
Y14.5M, 1982.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
REFERENCE ONLY.
AT DATUM PLANE -W-.
DIM
M
A
B
C
D
F
G
K
L
MILLIMETERS
MIN
2.90
2.90
0.80
0.05
0.40
0.25
0
0.65 BSC
4.90 BSC
_
MAX
3.10
3.10
1.10
0.15
0.70
0.40
6
_
0.031
0.002
0.016
0.010
0.114
0.114
MIN
0.026 BSC
0.193 BSC
0
INCHES
_
0.122
0.122
0.043
0.006
0.028
0.016
MAX
6
_