IRF6611 International Rectifier, IRF6611 Datasheet - Page 3
IRF6611
Manufacturer Part Number
IRF6611
Description
MOSFET N-CH 30V 32A DIRECTFET
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet
1.IRF6611.pdf
(10 pages)
Specifications of IRF6611
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
2.6 mOhm @ 27A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
32A
Vgs(th) (max) @ Id
2.25V @ 250µA
Gate Charge (qg) @ Vgs
56nC @ 4.5V
Input Capacitance (ciss) @ Vds
4860pF @ 15V
Power - Max
3.9W
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric MX
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
IRF6611TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IRF6611TR1
Manufacturer:
IR
Quantity:
1 710
board (still air).
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
Surface mounted on 1 in. square Cu
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling , mounting pad.
Mounted on minimum footprint full size board with metalized
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.001
0.01
100
0.1
10
1E-006
1
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.20
0.10
0.05
0.02
0.01
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
kl
k
il
jl
gÃ
Parameter
Parameter
l
0.001
t 1 , Rectangular Pulse Duration (sec)
0.01
τ
T
R
J
τ
C
θ
J
τ
1
Ci= τi/Ri
is measured at
measured with thermocouple incontact with top (Drain) of part.
τ
1
Ci τi/Ri
0.1
R
1
R
1
τ
2
τ
R
2
2
R
2
T
1
J
Typ.
12.5
of approximately 90°C.
–––
–––
1.0
20
R
τ
3
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
3
R
τ
3
3
-40 to + 150
τ
A
τ
Ri (°C/W)
Max.
0.031
10
footprint full size board with
metalized back and with small
clip heatsink (still air)
270
3.9
2.5
1.8310
16.033
14.139
89
Mounted on minimum
Max.
–––
–––
–––
1.4
32
100
0.000686
0.786140
τi (sec)
28
1000
Units
Units
°C/W
W/°C
°C
W
3