IRF6611 International Rectifier, IRF6611 Datasheet - Page 3

MOSFET N-CH 30V 32A DIRECTFET

IRF6611

Manufacturer Part Number
IRF6611
Description
MOSFET N-CH 30V 32A DIRECTFET
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF6611

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
2.6 mOhm @ 27A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
32A
Vgs(th) (max) @ Id
2.25V @ 250µA
Gate Charge (qg) @ Vgs
56nC @ 4.5V
Input Capacitance (ciss) @ Vds
4860pF @ 15V
Power - Max
3.9W
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric MX
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
IRF6611TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF6611TR1
Manufacturer:
IR
Quantity:
1 710
ˆ
board (still air).
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
† Surface mounted on 1 in. square Cu
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling , mounting pad.
Mounted on minimum footprint full size board with metalized
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.001
0.01
100
0.1
10
1E-006
1
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.20
0.10
0.05
0.02
0.01
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
kl
k
il
jl
Parameter
Parameter
l
0.001
t 1 , Rectangular Pulse Duration (sec)
0.01
Š
τ
T
R
J
τ
C
θ
J
τ
1
Ci= τi/Ri
is measured at
measured with thermocouple incontact with top (Drain) of part.
τ
1
Ci τi/Ri
0.1
R
1
R
1
τ
2
τ
R
2
2
R
2
T
1
J
Typ.
12.5
of approximately 90°C.
–––
–––
1.0
20
R
τ
3
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
3
R
τ
3
3
-40 to + 150
τ
A
τ
Ri (°C/W)
Max.
0.031
10
footprint full size board with
metalized back and with small
clip heatsink (still air)
270
3.9
2.5
1.8310
16.033
14.139
89
ˆ Mounted on minimum
Max.
–––
–––
–––
1.4
32
100
0.000686
0.786140
τi (sec)
28
1000
Units
Units
°C/W
W/°C
°C
W
3

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