NTB25P06T4G ON Semiconductor, NTB25P06T4G Datasheet

MOSFET P-CH 60V 27.5A D2PAK

NTB25P06T4G

Manufacturer Part Number
NTB25P06T4G
Description
MOSFET P-CH 60V 27.5A D2PAK
Manufacturer
ON Semiconductor
Type
Power MOSFETr
Datasheet

Specifications of NTB25P06T4G

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
82 mOhm @ 25A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
27.5A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
50nC @ 10V
Input Capacitance (ciss) @ Vds
1680pF @ 25V
Power - Max
120W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Configuration
Single
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.082 Ohm @ 10 V
Forward Transconductance Gfs (max / Min)
13 S
Drain-source Breakdown Voltage
60 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
25 A
Power Dissipation
120000 mW
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Rohs Compliant
YES
Number Of Elements
1
Polarity
P
Channel Mode
Enhancement
Drain-source On-res
0.082Ohm
Drain-source On-volt
60V
Gate-source Voltage (max)
±15V
Operating Temp Range
-55C to 175C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
2 +Tab
Package Type
D2PAK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NTB25P06T4GOS
NTB25P06T4GOS
NTB25P06T4GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTB25P06T4G
Manufacturer:
FREESCALE
Quantity:
760
Part Number:
NTB25P06T4G
Manufacturer:
ON
Quantity:
800
Part Number:
NTB25P06T4G
Manufacturer:
ON
Quantity:
12 500
Company:
Part Number:
NTB25P06T4G
Quantity:
620
NTB25P06
Power MOSFET
−60 V, −27.5 A, P−Channel D
withstand high energy in the avalanche and commutation modes.
Features
Typical Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1″ pad size
2. When surface mounted to an FR4 board using the minimum recommended
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 3
Maximum Lead Temperature for Soldering
Purposes, (1/8″ from case for 10 s)
Drain−to−Source Voltage
Gate−to−Source Voltage
Drain Current
Total Power Dissipation @ T
Operating and Storage
Single Pulse Drain−to−Source Avalanche
Thermal Resistance
Designed for low voltage, high speed switching applications and to
Pb−Free Packages are Available
PWM Motor Controls
Power Supplies
Converters
Bridge Circuits
(Cu Area 1.127 in
pad size (Cu Area 0.412 in
Temperature Range
Energy − Starting T
(V
I
L(pk)
DD
− Continuous
− Non−Repetitive (t
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
− Continuous @ T
− Single Pulse (t
= 25 V, V
= 20 A, L = 3 mH, R
GS
Rating
2
).
= 10 V,
J
p
(T
= 25°C
v10 ms)
A
p
J
v10 ms)
= 25°C
= 25°C unless otherwise noted)
G
2
A
).
= 25 W)
= 25°C
Symbol
T
V
V
R
R
R
J
2
V
E
I
GSM
P
DSS
, T
T
DM
I
qJC
qJA
qJA
GS
AS
D
PAK
D
L
stg
−55 to
Value
+175
"15
"20
27.5
1.25
46.8
63.2
−60
120
600
260
80
1
°C/W
Unit
Vpk
Apk
mJ
°C
°C
W
V
V
A
†For information on tape and reel specifications,
NTB25P06
NTB25P06G
NTB25P06T4
NTB25P06T4G
1
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
V
CASE 418B
(BR)DSS
−60 V
Device
3
2
D
2
PAK
NTB25P06 = Device Code
G
A
Y
WW
ORDERING INFORMATION
G
http://onsemi.com
4
65 mW @ −10 V
R
(Pb−Free)
(Pb−Free)
Package
DS(on)
D
D
D
D
P−Channel
2
2
2
2
= Pb−Free Device
= Assembly Location
= Year
= Work Week
PAK
PAK
PAK
PAK
D
Publication Order Number:
MARKING DIAGRAM
& PIN ASSIGNMENT
TYP
S
Gate
800/Tape & Reel
800/Tape & Reel
25P06G
Drain
Drain
50 Units/Rail
50 Units/Rail
AYWW
Shipping
NTB25P06/D
NTB
I
−27.5 A
D
Source
MAX

Related parts for NTB25P06T4G

NTB25P06T4G Summary of contents

Page 1

... R qJA 63.2 R qJA °C T 260 L Device NTB25P06 NTB25P06G NTB25P06T4 NTB25P06T4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1 http://onsemi.com R TYP I MAX DS(on) D −27 −10 V P− ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage (Note 3) = −250 mA (Positive Temperature Coefficient) Zero Gate Voltage Drain Current ( − 25°C) GS ...

Page 3

V = − −8 V − −V , DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 1. On−Region Characteristics 0 − ...

Page 4

2500 C iss 2000 C rss 1500 1000 500 C 0 −V − GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS) Figure 7. Capacitance Variation ...

Page 5

... PL 0.13 (0.005) M VARIABLE CONFIGURATION ZONE VIEW W−W VIEW W−W 1 10.66 0.42 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NTB25P06 PACKAGE DIMENSIONS 2 D PAK CASE 418B−04 ISSUE ...

Page 6

... Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com NTB25P06 N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 6 ON Semiconductor Website: http://onsemi ...

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