GRM21BR71E474KC01L Murata Electronics, GRM21BR71E474KC01L Datasheet - Page 142

• Manufacturer Part Number: GRM21BR71E474KC01L
• Description: Cap Ceramic 0.47uF 25VDC X7R 10% SMD 0805 Embossed T/R
• Manufacturer: Murata Electronics
• Type: Flatr

Specifications of GRM21BR71E474KC01L

• Package/case: 0805
• Mounting: Surface Mount
• Capacitance Value: 0.47 uF
• Dielectric: X7R
• Voltage: 25 Vdc
• Product Length: 2 mm
• Product Height: 1.25 mm
• Tolerance: 10 %

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
4-3. Correction with a Soldering Iron
1. When sudden heat is applied to the components when
2. After soldering, do not allow the component/PCB to
3. The operating time for the re-working should be as short
4. Optimum Solder amount when re-working with a
4-4. Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as
5. Washing
Excessive ultrasonic oscillation during cleaning can cause
the PCBs to resonate, resulting in cracked chips or broken
solder joints. Take note not to vibrate PCBs.
140
!Caution
!Caution
using a soldering iron, the mechanical strength of the
components will decrease because the extreme
temperature change can cause deformations inside the
components. In order to prevent mechanical damage to
the components, preheating is required for both the
components and the PCB board. Preheating conditions,
(The "Temperature of the Soldering Iron Tip", "Preheating
Temperature," "Temperature Differential" between the
iron tip and the components and the PCB), should be
within the conditions of table 3. It is required to keep the
temperature differential between the soldering iron and
the component surfaces ( T) as small as possible.
rapidly cool down.
as possible. When re-working time is too long, it may
cause solder leaching, in turn causing a reduction in the
adhesive strength of the terminations.
Soldering lron
4-1. For sizes smaller than 0603, (GRM03/15/18,
4-2. A soldering iron with a tip of ø3mm or smaller should
4-3. Solder wire with ø0.5mm or smaller is required for
transformers and ICs) are being mounted, chips may
crack and solder joints may break.
Before mounting leaded components, support the PCB
using backup pins or special jigs to prevent warping.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
GJM03/15, GQM18), the top of the solder fillet
should be lower than 2/3's of the thickness of the
component or 0.5mm whichever is smaller. For 0805
and larger sizes, (GRM21/31/32/43/55, GQM21/22),
the top of the solder fillet should be lower than 2/3's
of the thickness of the component. If the solder
amount is excessive, the risk of cracking is higher
during board bending or under any other stressful
condition.
be used. It is also necessary to keep the soldering
iron from touching the components during the
re-work.
soldering.
Table 3
GRM03/15/18/21/31
GJM03/15
GQM18/21
GRM32/43/55
GQM22
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Part Number
350 C max.
280 C max.
Temperature
of Soldering
Iron Tip
Temperature
150 C min.
150 C min.
Preheating
Continued on the following page.
Temperature
Differential
TV190 C
TV130 C
Solder Amount
( T)
Atmosphere
in section
Air
Air
C02E.pdf
10.12.20