GRM21BR71E474KC01L Murata Electronics, GRM21BR71E474KC01L Datasheet - Page 211

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GRM21BR71E474KC01L

Manufacturer Part Number
GRM21BR71E474KC01L
Description
Cap Ceramic 0.47uF 25VDC X7R 10% SMD 0805 Embossed T/R
Manufacturer
Murata Electronics
Type
Flatr
Datasheet

Specifications of GRM21BR71E474KC01L

Package/case
0805
Mounting
Surface Mount
Capacitance Value
0.47 uF
Dielectric
X7R
Voltage
25 Vdc
Product Length
2 mm
Product Height
1.25 mm
Tolerance
10 %
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Vibration and Impact
3. Land Layout for Cropping PC Board
210
!Caution
[Component Direction]
Caution (Soldering and Mounting)
Do not expose a capacitor to excessive shock or vibration
during use.
Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
<Example
to be avoided>
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
<Example
of improvement>
Locate chip
horizontal to the
direction in which
stress acts.
2. Circuit Board Material
[Chip Mounting Close to Board Separation Point]
It is possible for the chip to crack by the expansion and
shrinkage of a metal board.
Please contact us if you want to use our ceramic
capacitors on a metal board such as Aluminum.
Perforation
A
Slit
B
D
C
Continued on the following page.
Chip arrangement
Worst AGCGB~D Best
C02E.pdf
10.12.20

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