GRM1885C1H820FA01D Murata Electronics, GRM1885C1H820FA01D Datasheet - Page 179

• Manufacturer Part Number: GRM1885C1H820FA01D
• Description: Cap Ceramic 82pF 50VDC C0G 1% SMD 0603 Paper T/R
• Manufacturer: Murata Electronics
• Type: Flatr

Specifications of GRM1885C1H820FA01D

• Package/case: 0603
• Mounting: Surface Mount
• Capacitance Value: 82 pF
• Dielectric: C0G
• Voltage: 50 Vdc
• Product Length: 1.6 mm
• Product Height: 0.8 mm
• Tolerance: 1 %

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
178
No.
12
13
14
15
16 Life
* "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Only for LCD Backlight Inverter Circuit Specifications and Test Methods
GRM/DC3.15kV Series Specifications and Test Methods
Continued from the preceding page.
Solderability of
Termination
Resistance
to Soldering
Heat
Temperature
Cycle
Humidity
(Steady
State)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Item
Appearance
Capacitance
Change
Q
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
Q
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
Q
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
Q
I.R.
Dielectric
Strength
75% of the terminations are to be soldered evenly
and continuously.
No marking defects
Within T2.5%
1,000 min.
More than 10,000M
In accordance with item No.4
No marking defects
Within T2.5%
1,000 min.
More than 10,000M
In accordance with item No.4
No marking defects
Within T5.0%
350 min.
More than 1,000M
In accordance with item No.4
No marking defects
Within T3.0%
350 min.
More than 1,000M
In accordance with item No.4
Specifications
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion). Immerse in
solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5 C Lead Free Solder (Sn-3.0Ag-0.5Cu)
Preheat the capacitor as in table.
Immerse the capacitor in solder solution at 260T5D for 10T1 sec.
Let sit at room condition* for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
*Preheating
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24T2 hrs. at room condition,* then measure.
Let the capacitor sit at 40T2D and relative humidity of 90 to 95%
for 500
Remove and let sit for 24T2 hrs. at room condition,* then
measure.
Apply 120% of the rated voltage for 1,000
operating temperature T3D.
Remove and let sit for 24T2 hrs. at room condition,* then
measure.
The charge/discharge current is less than 50mA.
Step
Step
W24
1
2
1
2
3
4
Y
0
hrs.
Max. Operating Temp.T2
Min. Operating Temp.T3
235T5 C H60A or H63A Eutectic Solder
Glass Epoxy Board
Temperature (D)
Temperature
Room Temp.
Room Temp.
100 to 120D
170 to 200D
Fig. 4
Test Method
Solder resist
Cu
W48
Y
0
Time (min.)
hrs. at maximum
1 min.
1 min.
30T3
2 to 3
30T3
2 to 3
Time
C02E.pdf
10.12.20