HSMP-3824-TR1G Avago Technologies US Inc., HSMP-3824-TR1G Datasheet
HSMP-3824-TR1G
Specifications of HSMP-3824-TR1G
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HSMP-3824-TR1G Summary of contents
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... Surface Mount RF PIN Switch and Limiter Diodes Data Sheet Description/Applications The HSMP-382x series is optimized for switching ap- plications where ultra-low resistance is required. The HSMP-482x diode is ideal for limiting and low induc- tance switching applications up to 1.5 GHz. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime. ...
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... Package Number Marking Lead HSMP- Code Code Configuration 4820 FA A Dual Anode 482B FA A Dual Anode Test Conditions Typical Parameters 25°C C Part Number Series Resistance HSMP- R (Ω) S 382x 1.5 T est Conditions f = 100 MHz 2 Unit SOT-23 SOT-323 Amp °C 150 150 °C -65 to 150 -65 to 150 °C/W 500 150 ...
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... I – FORWARD BIAS CURRENT (mA) F Figure 3. RF Resistance at 25C vs. Forward Bias Current 1.5 GHz 20 15 1.0 GHz 10 5 Measured with external bias return POWER IN (dBm) Figure 6. Large Signal Transfer Curve of the HSMP-482x Limiter. RF COMMON RF 2 BIAS ...
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... Cells as Required). 4 continued BIAS BIAS Figure 10. Very High Isolation SPDT Switch, Dual Bias. Figure 12. Power Limiter Using HSMP-3822 Figure 12. Power Limiter Using HSMP-3822 Diode Pair. Diode Pair. See Application Note 1050 See Application Note 1050 for details. for details. RF COMMON RF 2 ...
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... Typical Applications for HSMP-482x Low Inductance Series Microstrip Series Connection for HSMP-482x Series In order to take full advantage of the low inductance of the HSMP-482x series when using them in series applications, both lead 1 and lead 2 should be connected together, as shown in Figure 14 HSMP-482x Figure 13. Internal Connections. Figure 13. Internal Connections. ...
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Assembly Information SOT-323 PCB Footprint A recommended PCB pad layout for the miniature SOT- 323 (SC-70) package is shown in Figure 19 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. 0.026 0.079 0.039 0.022 Dimensions in inches Figure 19. Recommended PCB Pad Layout for Avago’s ...
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SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT-323/-23 package, will ...
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... Lead Material ....................................................... Copper (SOT-323); Alloy 42 (SOT-23) Lead Finish ............................................................................ Tin 100% (Lead-free option) Maximum Soldering Temperature ............................................... 260°C for 5 seconds Minimum Lead Strength . ............................................................................. 2 pounds pull Typical Package Inductance ..........................................................................................2 nH Typical Package Capacitance ................................................. 0.08 pF (opposite leads) Ordering Information Specify part number followed by option. For example: HSMP - 382x - XXX Option Descriptions -BLKG = Bulk, 100 pcs. per antistatic bag -TR1G = Tape and Reel, 3000 devices per 7" reel -TR2G = Tape and Reel, 10,000 devices per 13" reel Tape and Reeling conforms to Electronic Industries RS-481, “ ...
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Device Orientation For Outlines SOT-23/323 REEL CARRIER TAPE USER FEED DIRECTION COVER TAPE Tape Dimensions and Product Orientation For Outline SOT- 9° MAX A 0 DESCRIPTION SYMBOL CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER PERFORATION ...
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Tape Dimensions and Product Orientation For Outline SOT-323 DESCRIPTION SYMBOL CAVITY LENGTH A 0 WIDTH B 0 DEPTH K 0 PITCH P BOTTOM HOLE DIAMETER D 1 PERFORATION DIAMETER D PITCH P ...