FX8C-60P-SV2(92) Hirose, FX8C-60P-SV2(92) Datasheet - Page 15

• Manufacturer Part Number: FX8C-60P-SV2(92)
• Description: Conn Board to Board HDR 60 POS 0.6mm Solder ST SMD Embossed T/R
• Manufacturer: Hirose
• Type: Board to Boardr

Specifications of FX8C-60P-SV2(92)

• Pitch: 0.6 mm
• Number Of Rows: 2
• Number Of Contacts: 60
• Gender: HDR
• Contact Plating: Gold
• Termination Method: Solder

A166
FX8 Series
Note that FX8 series and FX8C series are not mated with each other.
■Features
1. Stacking Height 3mm to 16mm available
2. SMT Coplanarity
3. Mating Guide
4. Mis-insertion Prevention
■Applications
Note pc, business equipments, which require miniaturization or light-weight
The board to board stacking height can correspond to
3mm~16mm.
The coplanarity of the SMT solder area lead is maintained at
the high accuracy of less than 0.1mm.
The very small and guide rib is provided, and secures
self-alignment, considering the mating operativity into accounts.
The boss prevents mis-insertion in the board to cause due to
the boss position and boss diameter.
0.6mm Pitch Stacking Height 3mm to 16mm Connector
FX8, FX8C Series
±0.6mm
FX8C Series
●
●
Stacking Height 3,4mm-FX8 Series
Stacking Height 5 to 16mm-FX8C Series
5 to 16mm
3,4mm