FX8C-60P-SV2(92) Hirose, FX8C-60P-SV2(92) Datasheet - Page 23

• Manufacturer Part Number: FX8C-60P-SV2(92)
• Description: Conn Board to Board HDR 60 POS 0.6mm Solder ST SMD Embossed T/R
• Manufacturer: Hirose
• Type: Board to Boardr

Specifications of FX8C-60P-SV2(92)

• Pitch: 0.6 mm
• Number Of Rows: 2
• Number Of Contacts: 60
• Gender: HDR
• Contact Plating: Gold
• Termination Method: Solder

BConnector Precautions
1. Tolerance Clearance on Mating Side
2. Fixation Between Mounting Boards
3. Stacking General Tolerance in Mating
4. Handling Two-piece Connection Product
5. Mounting Temperature Profile (Reference)
6. Cautions
The effective contact length of the product is set to 2.0mm. Please use the product
so as to set to less than 12mm the clearance between the header and the receptacle in the mating process.
If this product is fixed only by mating force, Please consider the fixing method so as not to apply loads such as vibration, shock and so
on.
Stack
Note: Please Note that the above tolerance of the stacking height doesn't include the solder paste thickness.
Both joint bar edges of the two-piece connection product are fixed by joints, while the mating process can't be performed in that state.
Before the mating process, please remove the joint bars as if pull it up. (Don't remove the joint bars before mounting on the board. )
This product is made as the thin formed product in order to be miniaturized.
Amm
A
0.2
0.3
mm
FX8, FX8C Series 0.6mm Pitch Stacking Height 3mm to 16mm Connector
HRS test conditions
Before removing joint bar
After removing joint bar
A181