MT47H32M16HR-25E IT:G Micron Technology Inc, MT47H32M16HR-25E IT:G Datasheet - Page 31

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MT47H32M16HR-25E IT:G

Manufacturer Part Number
MT47H32M16HR-25E IT:G
Description
32MX16 DDR2 SDRAM PLASTIC IND TEMP PBF FBGA 1.8V
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT47H32M16HR-25E IT:G

Lead Free Status / Rohs Status
Compliant
Table 12: AC Operating Specifications and Conditions (Continued)
Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table;
V
DDQ
DQS output access
time from CK/CK#
DQS read preamble
DQS read
postamble
CK/CK# to DQS
Low-Z
DQS rising edge to
CK rising edge
DQS input-high
pulse width
DQS input-low
pulse width
DQS falling to CK
rising: setup time
DQS falling from
CK rising:
hold time
Write preamble
setup time
DQS write
preamble
DQS write
postamble
WRITE command
to first DQS
transition
= +1.8V ±0.1V, V
Parameter
AC Characteristics
DD
Symbol
t
t
DQSCK
t
WPRES
t
t
= +1.8V ±0.1V
t
t
t
t
DQSH
WPRE
t
WPST
DQSS
DQSL
RPRE
RPST
t
t
DSH
DSS
LZ
1
–300
Min
-187E
Max
+300
–350
Min
-25E
Max
+350
–350 +350
Min
-25
Max
MAX = WL +
MAX = +0.25 ×
MAX =
MIN = –0.25 ×
MIN = WL -
MIN =
MIN = 0.35 ×
MIN = 0.35 ×
MIN = 0.35 ×
MAX = 1.1 ×
MAX = 0.6 ×
MAX = 0.6 ×
MIN = 0.9 ×
MIN = 0.4 ×
MIN = 0.2 ×
MIN = 0.2 ×
MIN = 0.4 ×
MAX = n/a
MAX = n/a
MAX = n/a
MAX = n/a
MAX = n/a
MAX = n/a
–400
Min
MIN = 0
t
t
-3E
AC (MIN)
AC (MAX)
Max
+400
t
DQSS
t
DQSS
t
t
t
t
t
t
t
t
CK
CK
t
t
CK
CK
t
CK
CK
CK
CK
t
CK
CK
CK
CK
t
CK
–400
Min
-3
Max
+400
–450
Min
-37E
Max
+450
–500
Min
-5E
+500
Max
Units Notes
t
t
t
t
t
t
t
t
t
t
ps
CK
CK
ps
CK
CK
CK
CK
CK
ps
CK
CK
CK
17, 18,
17, 18,
19, 21,
19, 20
23, 24
18, 25
19
19
22
18
18
18
18
18
18

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