C8051F340-GQR Silicon Laboratories Inc, C8051F340-GQR Datasheet - Page 36

• Manufacturer Part Number: C8051F340-GQR
• Description: MCU 8-Bit C8051F34x 8051 CISC 64KB Flash 3.3V/5V 48-Pin TQFP T/R
• Manufacturer: Silicon Laboratories Inc

Specifications of C8051F340-GQR

• Package: 48TQFP
• Device Core: 8051
• Family Name: C8051F34x
• Maximum Speed: 48 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 40
• Interface Type: I2C/SMBus/SPI/UART/USB
• On-chip Adc: 17-chx10-bit
• Number Of Timers: 4
• Ram Size: 4.25 KB
• Program Memory Size: 64 KB
• Program Memory Type: Flash
• Operating Temperature: -40 to 85 °C

C8051F340/1/2/3/4/5/6/7/8/9/A/B/C/D
36
Notes:
General:
Solder Mask Design:
Stencil Design:
Card Assembly:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
Figure 4.6. LQFP-32 Recommended PCB Land Pattern
the solder mask and the metal pad is to be 60 µm minimum, all the way around
the pad.
should be used to assure good solder paste release.
specification for Small Body Components.
Table 4.5. LQFP-32 PCB Land Pattern Dimensions
Dimension
C1
C2
X1
Y1
E
Rev. 1.3
8.40
8.40
0.40
1.25
Min
0.80 BSC
Max
8.50
8.50
0.50
1.35