XC3S1200E-4FG400I Xilinx Inc, XC3S1200E-4FG400I Datasheet - Page 72

• Manufacturer Part Number: XC3S1200E-4FG400I
• Description: FPGA Spartan®-3E Family 1.2M Gates 19512 Cells 572MHz 90nm (CMOS) Technology 1.2V 400-Pin FBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3Er

Specifications of XC3S1200E-4FG400I

• Package: 400FBGA
• Family Name: Spartan®-3E
• Device Logic Cells: 19512
• Device Logic Units: 2168
• Device System Gates: 1200000
• Number Of Registers: 17344
• Maximum Internal Frequency: 572 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 304
• Ram Bits: 516096
• Number Of Logic Elements/cells: 19512
• Number Of Labs/clbs: 2168
• Total Ram Bits: 516096
• Number Of I /o: 304
• Number Of Gates: 1200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 400-BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Functional Description
Master Serial Mode
For additional information, refer to the Master Serial Mode
chapter in UG332.
In Master Serial mode (M[2:0] = <0:0:0>), the Spartan-3E
FPGA configures itself from an attached Xilinx Platform
All mode select pins, M[2:0], must be Low when sampled,
when the FPGA’s INIT_B output goes High. After configura-
tion, when the FPGA’s DONE output goes High, the mode
select pins are available as full-featured user-I/O pins.
enable pull-up resistors on all user-I/O pins during configu-
ration or High to disable the pull-up resistors. The HSWAP
control must remain at a constant logic level throughout
72
P
Recommend
Similarly, the FPGA’s HSWAP pin must be Low to
open-drain
PROG_B
driver
TMS
TDO
TCK
TDI
+2.5V
JTAG
Serial Master
Mode
‘0’
‘0’
‘0’
P
Figure 51: Master Serial Mode using Platform Flash PROM
HSWAP
M2
M1
M0
TDI
TMS
TCK
PROG_B
Spartan-3E
FPGA
VCCINT
+1.2V
GND
VCCAUX
VCCO_0
VCCO_2
INIT_B
DONE
DOUT
CCLK
TDO
DIN
www.xilinx.com
VCCO_0
+2.5V
V
Flash PROM, as illustrated in
plies the CCLK output clock from its internal oscillator to the
attached Platform Flash PROM. In response, the Platform
Flash PROM supplies bit-serial data to the FPGA’s DIN
input, and the FPGA accepts this data on each rising CCLK
edge.
FPGA configuration. After configuration, when the FPGA’s
DONE output goes High, the HSWAP pin is available as
full-featured user-I/O pin and is powered by the VCCO_0
supply.
The FPGA's DOUT pin is used in daisy-chain applications,
described later. In a single-FPGA application, the FPGA’s
DOUT pin is not used but is actively driving during the con-
figuration process.
+2.5V
V
D0
CLK
OE/RESET
CE
CF
TDI
TMS
TCK
Platform Flash
XCFxxS = +3.3V
XCFxxP = +1.8V
XCFxx
VCCINT
GND
DS312-2 (v3.8) August 26, 2009
Figure
VCCO
VCCJ
Product Specification
51. The FPGA sup-
CEO
TDO
DS312-2_44_082009
+2.5V
V
R