MMA02040E4701BB100 Vishay, MMA02040E4701BB100 Datasheet - Page 9

• Manufacturer Part Number: MMA02040E4701BB100
• Description: Res Thin Film 1406 4.7K Ohm 0.1% 1/4W ±15ppm/°C Molded Melf SMD Blister T/R
• Manufacturer: Vishay
• Type: Thin Filmr
• Series: MMAr

Specifications of MMA02040E4701BB100

• Case Size: 1406
• Resistance Value: 4.7 KOhm
• Power Rating: 1/4 W
• Tolerance: 0.1 %
• Metal Film: RESISTANCE
• Case Style: MMA0204
• Tolerance, +: 0.1%
• Tolerance, -: 0.1%
• Temp, Op. Max: 85(DEGREE C)
• Temp, Op. Min: -55(DEGREE
• Rohs Compliant: YES

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42
MMU 0102, MMA 0204, MMB 0207 - Precision
Vishay Beyschlag
Notes
1. The pulse load stability of professional MELF resistors applies for precision resistors also. However, severe pulse loads are likely to
2. Wave soldering is not recommended.
3. Special requirements apply to MICRO-MELF, MMU 0102:
* The quoted IEC standards are also released as EN standards with the same number and identical contents.
CLAUSE
60115-1
TEST PROCEDURES AND REQUIREMENTS
4.40
4.17.2
4.18.2
4.29
4.30
4.32
4.33
4.7
4.35
EN
jeopardize precision stability requirements.
- R < 100 Ω: ± (0.15 % R + 10 mΩ)
- 100 Ω ≤ R ≤ 10 kΩ: ± 0.1 % R
- R > 10 kΩ: ± 0.05 % R
METHOD
60068-2*
-
58 (Td)
58 (TD)
45 (XA)
45 (XA)
21 (Ue
21 (Ue
-
-
TEST
IEC
3
1
)
)
electrostatic
discharge
(Human Body
Model)
solderability
resistance to
soldering heat
component
solvent
resistance
solvent
resistance of
marking
shear (adhesion)
substrate
bending
voltage proof
flammability
TEST
For technical questions contact: [e-mail]
stability for product types:
IEC 61340-3-1*;
3 pos. + 3 neg. discharges
MMU 0102: 1.5 kV
MMA 0204: 2 kV
MMB 0207: 4 kV
solder bath method;
SnPb40; non-activated flux;
(215 ± 3) °C; (3 ± 0.3) s
solder bath method;
SnAg3Cu0,5 or SnAg3,5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
solder bath method;
(260 ± 5) °C; (10 ± 1) s
reflow method 2
(IR/forced gas convection);
(260 ± 5) °C; (10 ± 1) s
isopropyl alcohol; 50 °C;
method 2
isopropyl alcohol; 50 °C;
method 1, toothbrush
45 N
depth 2 mm, 3 times
U
IEC 60 695-11-5*, needle
flame test; 10 s
rms
= U
PROCEDURE
ins
Precision MELF Resistors
; 60 s
MMU 0102
MMA 0204
MMB 0207
± (0.01 % R + 5 mΩ)
100 Ω to 100 kΩ
100 Ω to 100 kΩ
100 Ω to 270 kΩ
OR BETTER
CLASS 0.05
STABILITY
no visible damage, no open circuit in bent position
good tinning (≥ 95 % covered); no visible damage
good tinning (≥ 95 % covered); no visible damage
± (0.02 % R + 10 mΩ)
marking legible; no visible damage
note 2
PERMISSIBLE CHANGE (ΔR)
no flashover or breakdown
± (0.5 % R + 50 mΩ)
no burning after 30 s
no visible damage
no visible damage
REQUIREMENTS
43 Ω to 147 kΩ
43 Ω to 221 kΩ
43 Ω to 510 kΩ
OR BETTER
STABILITY
CLASS 0.1
3)
± (0.025 % R + 5 mΩ)
Document Number: 28714
1)
± (0.05 % R + 10 mΩ)
± (0.05 % R + 10 mΩ)
22 Ω to 332 kΩ
10 Ω to 511 kΩ
Revision: 18-Jul-06
OR BETTER
15 Ω to 1 MΩ
CLASS 0.25
STABILITY
3)