AG606-G TriQuint, AG606-G Datasheet - Page 5

• Manufacturer Part Number: AG606-G
• Description: RF Amplifier 50-860MHz +/-0.7dB Gain
• Manufacturer: TriQuint
• Type: CATV Amplifierr

Specifications of AG606-G

• Operating Frequency: 860 MHz
• Noise Figure: 4.5 dB
• Operating Supply Voltage: 7 V
• Supply Current: 165 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: SOIC-8
• Minimum Operating Temperature: - 40 C
• Number Of Channels: 2 Channels
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1066850

AG606
Push-Pull CATV Amplifier
TriQuint Semiconductor, Inc • Phone [phone] • FAX: [phone] • e-mail: [e-mail] • Web site: www.TriQuint.com
This package is lead-free /green/ RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes.
AG606-G (Lead-Free Package) Mechanical Information
Outline Drawing
Land Pattern
The AG606 will be marked with an
“AG606G” designator with a lot code marked
below the part designator. The “Y” represents
the last digit of the year the part was
manufactured, the “XXX” is an auto-generated
number, and “Z” refers to a wafer number in a
lot batch.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1C
Value:
Test:
Standard:
ESD Rating: Class IV
Value
Test:
Standard:
MSL Rating: Level 2 at +260 °C convection reflow
Standard:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Mounting Config. Notes
ESD / MSL Information
Ground / thermal vias are critical for the proper performance
of this device.
diameter drill and have a final plated through diameter of
.25mm (.010”)
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
To ensure reliable operation, device ground paddle-to-
ground pad solder joint is critical.
Add mounting screws near the part to fasten the board to a
heatsink.
contacts the heatsink.
For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
If the PCB design rules allow, ground vias should be placed
under the land pattern for better RF and thermal
performance. Otherwise ground vias should be placed as
close to the land pattern as possible.
All dimensions are in mm. Angles are in degrees.
Product Marking
Ensure that the ground / thermal via region
1000 to 2000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes greater than 1000 V
Charge Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020A
Vias should use a .35mm (#80/.0135”)
Page 5 of 5
July 2009